Mcm Development Using Fine Pitch Ball Bump

Abstract

A fine-pitch ( less than 100 micro-meter pads pitch ) aluminum pad flip chip assembly technology for use with the built-up Printed Wiring Boards (PWB) has been developed and named “Lead-Less-Chip Assembly (LLC Assembly)” technology. Our newly developed technology consists of three points: Forming gold-ball-bumps on the aluminum pads of the bare LSI chip by a wire ball bonding method. Solder-coating on the copper pads of the built-up PWB using Micro Punching technology or the Super-Juffit technology. Flux-less solder bonding the bare chip onto the PWB with a nitrogen atmosphere.A reliability evaluation performed on a single chip and multi chip modules assembled using this LLC Assembly technology with test chips and real C-MOS devices showed a high level of endurance. We have applied this technology to Multichip modules (MCMs) for Note Personal Computers and portable terminals.