Matrix–particle interactions in catalyzed and uncatalyzed copper‐filled epoxy matrix composites

Abstract

Epoxy composites filled with copper particles with sizes of the order of 100 μm are studied with the aim of analyzing the particle-matrix interphase. Two matrixes are used: diglycidyl ether of bisphenol A resin (DGEBA)-anhydride catalyzed using a tertiary amine, and uncatalyzed DGEBA-anhydride. The surface of both types of composites was analyzed using scanning electron microscopy, X-ray photoelectron spectroscopy, and instrumented nanoindentation. The formation of Cu(I) and Cu(II) complexes is revealed using X-ray photoelectron spectroscopy, while instrumented nanoindentation measurements allow us to determine regions with different mechanical properties in the uncatalyzed composite. The influence of anhydride and the type of curing reaction on the formation of copper complexes is analyzed. The main results point out that copper particles can interact strongly with the epoxy, depending on the chemistry and kinetics of the curing reaction, to modify the composite.

Transition Metal β‐Diketonate Adhesion Promoters in Epoxy‐Anhydride Resin

“…Similar descriptions of the resin-substrate competition were also found in literatures by Tognana et al, [50] where Cu particles reacted further with anhydride curing agents in uncatalyzed resin systems thanks to their slower cure kinetics; and Boerio et al, [51] where pure anhydride monomers dissolved Cu surface oxide while epoxy/anhydride adhesive formulations only form certain coordinative bonding at the interfaces. Such competition effects in an epoxy/dicyandiamide (DICY) system became unfavorable when the Cu oxide species impeded the resin cure by consuming the DICY curing agents.…”

“…Such competition effects in an epoxy/dicyandiamide (DICY) system became unfavorable when the Cu oxide species impeded the resin cure by consuming the DICY curing agents. [52] It was also clear that acid anhydride can react with Cu and surface active hydrogens in their monomer or monoester intermediate state, though requiring prolonged contact [50] or thermal activation [46,51] typically to higher temperatures when working as fluxing agents to deoxidize metal surfaces. This was also confirmed by calorimetry experiments (Figure S42, Supporting Information).…”

Potentialities of a Laser-Induced Breakdown Spectroscopy Technique in the Study of Polymer Composites

“…However, there are specific problems that need to be resolved in order to develop a complete understanding and to model the composite, with the aim of predicting their properties and the response of the material in service. Some of the issues that have been studied are, for example, the formation of an interphase region, 2 the influence of the filler on the curing for thermoset matrix 3 and the effect of the particle size on the physical properties of the composite, 4 among others. Within the area of the present research, some of the authors developed a specific evaluation of the content of filler particles in copper matrix epoxy composites by means of positron annihilation lifetime spectroscopy.…”

First‐principles study on the adhesive and electronic property of c‐BN(111)/Cu(111) interface

“…Cu has excellent mechanical, electrical, and thermal properties. Cu matrix composites are widely used in industry and military fields . c‐BN/Cu composites have become a research hotspot because they combine the advantage of Cu and c‐BN.…”

“…Cu matrix composites are widely used in industry and military fields. [1][2][3][4][5] c-BN/Cu composites have become a research hotspot because they combine the advantage of Cu and c-BN. Researchers believe that the interface structure between c-BN and Cu is the critical factor affecting the properties of composites.…”