2007
DOI: 10.1016/j.mee.2006.11.011
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Mathematical modeling of CMP conditioning process

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Cited by 37 publications
(21 citation statements)
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“…Figure 1 schematically illustrates each of these phenomena and its relationship to the material removal rate equation. 14 Chang et al 16 modeled the typical kinematics of the conditioner and showed that the conditioner will wear the pad non-uniformly resulting in a concave pad surface. [15][16][17][18] Here the workpiece and/or conditioner (typically a fixed diamond abrasive to treat the pad for CMP or a sacrificial workpiece used during pad optical polishing) is loaded against the pad surface and, as a result, spatial and temporal changes in the pad properties (thickness profile, roughness, slurry charging level, etc.)…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Figure 1 schematically illustrates each of these phenomena and its relationship to the material removal rate equation. 14 Chang et al 16 modeled the typical kinematics of the conditioner and showed that the conditioner will wear the pad non-uniformly resulting in a concave pad surface. [15][16][17][18] Here the workpiece and/or conditioner (typically a fixed diamond abrasive to treat the pad for CMP or a sacrificial workpiece used during pad optical polishing) is loaded against the pad surface and, as a result, spatial and temporal changes in the pad properties (thickness profile, roughness, slurry charging level, etc.)…”
Section: Introductionmentioning
confidence: 99%
“…The influences of pad wear and changes in pad properties during polishing have been previously investigated. [15][16][17][18] Here the workpiece and/or conditioner (typically a fixed diamond abrasive to treat the pad for CMP or a sacrificial workpiece used during pad optical polishing) is loaded against the pad surface and, as a result, spatial and temporal changes in the pad properties (thickness profile, roughness, slurry charging level, etc.) can occur.…”
Section: Introductionmentioning
confidence: 99%
“…Various researches revealed concavity of the pad shape by the conditioner disc oscillating on the pad [20,21]. In summary, the disadvantages of these methods lie in: (1) There is no method for measuring the pad shape, which is usually speculated based on the surface figure of the polished optics; (2) The planarization of the polyurethane pad by conditioner disc oscillating on the pad is difficult to achieve by the large diamond conditioner disc.…”
Section: Introductionmentioning
confidence: 99%
“…Hooper et al (2002) revealed a correlation between the conditioning density and both the wear geometry and the surface properties of the polishing pad. Chang et al (2007) proposed a conditioning process and mathematical modelling of pad wear using kinematics analysis. They demonstrated that the thickness variation in the polishing pad can be predicted with their conditioning model.…”
Section: Introductionmentioning
confidence: 99%