2001
DOI: 10.1117/12.410703
|View full text |Cite
|
Sign up to set email alerts
|

Materials for an attenuated phase-shifting mask in 157-nm lithography

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2001
2001
2002
2002

Publication Types

Select...
3
2

Relationship

1
4

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 8 publications
0
1
0
Order By: Relevance
“…These include MoSi, CrF, ZrSi, and other materials, and some of these have already been put into practical use.U4) In an earlier study, the authors evaluated the suitability ofZrSi, and SiO for use as materials for F2 lithography, and reported that these material systems do indeed exhibit sufficient optical durability. (5) In this work, we propose a Ta-based and a Cr-base material as a new material for fabricating F2 lithography Att-PSMs. Then, we assess the irradiation durability of Ta-group bilayer films (Ta and TaSiO) and Cr film to F2 laser light, and demonstrate the effectiveness of Ta-based and Cr-based Att-PSMs.…”
Section: Introductionmentioning
confidence: 99%
“…These include MoSi, CrF, ZrSi, and other materials, and some of these have already been put into practical use.U4) In an earlier study, the authors evaluated the suitability ofZrSi, and SiO for use as materials for F2 lithography, and reported that these material systems do indeed exhibit sufficient optical durability. (5) In this work, we propose a Ta-based and a Cr-base material as a new material for fabricating F2 lithography Att-PSMs. Then, we assess the irradiation durability of Ta-group bilayer films (Ta and TaSiO) and Cr film to F2 laser light, and demonstrate the effectiveness of Ta-based and Cr-based Att-PSMs.…”
Section: Introductionmentioning
confidence: 99%