Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics

Nguyen, Van-Thuc; Fang, Te‐Hua

doi:10.1016/j.ceramint.2020.05.263

Cited by 38 publications

(14 citation statements)

References 63 publications

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“…Therefore, this report surveys the effect of substrate temperature from 300 to 1200 K on the machining process. Ordinarily, most studies decide to choose a perfectly flat surface 36 – 38 , a rough surface 39 – 41 , or a surface covered by a thin amorphous/oxidation layer 42 – 44 to investigate the tribological properties. This report tries to examine both a perfect flat surface and a deformed surface by machining for one time or multi-times, as shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Nguyen

Fang

2021

Sci Rep

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This report explores the effects of machining depth, velocity, temperature, multi-machining, and grain size on the tribological properties of a diamond substrate. The results show that the appearance of graphite atoms can assist the machining process as it reduces the force. Moreover, the number of graphite atoms relies on the machining speed and substrate temperature improvement caused by the friction force. Besides, machining in a machined surface for multi-time is affected by its rough, amorphous, and deformed surface. Therefore, machining in the vertical direction for multi-time leads to a higher rate of deformation but a reduction in the rate of graphite atoms generation. Increasing the grain size could produce a larger graphite cluster, a higher elastic recovery rate, and a higher temperature but a lower force and pile-up height. Because the existence of the grain boundaries hinders the force transformation process, and the reduction in the grain size can soften the diamond substrate material.

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Section: Methodsmentioning

confidence: 99%

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Nguyen

Fang

2021

Sci Rep

Self Cite

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“…This leads to a decrease in MRR at higher polishing speed, indicating that blindly increasing the polishing speed cannot achieve a higher MRR [48], which is inconsistent with the report of Li et al [49] where the stacking height was reduced, but the MRR consistently improved with increasing polishing speed. Many studies [14,31,50] regions is caused by thermal activation as the part of work done by the cutting and extrusion process of the abrasive is converted into internal energy [51]. Besides, after polishing, some atoms suffering elastic deformation can recover to their original structure, which indicates that the amorphous phase transition of Invar is partially reversible [19,52].…”

Section: Effect Of Polishing Speedmentioning

confidence: 99%

Exploring the nano-polishing mechanisms of Invar

Wang

Hua

Luo

et al. 2022

Tribology International

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“…During the second planetary motion, Gillespie et al [9] and Holzknecht et al [10] were measured the final surface quality and material removal rate (MRR) by the abrasive dynamics and the initial surface roughness of the workpiece. Nguyen et al [11] was studied Silicon carbide (SiC) abrasive, which has stable chemical properties, high thermal conductivity, low thermal expansion coefficient, good wear resistance, and can be used as abrasive medium. Quartz, the main chemical component of is SiO2, which is an inorganic substance with very stable physical and chemical properties.…”

Section: Introductionmentioning

confidence: 99%

Analysis of abrasives on cutting edge preparation by drag finishing

Wang

et al. 2022

Int J Adv Manuf Technol

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Cutting edge preparation has become more important for tool performance. The micro-shape, radius and surface topography of the cutting edge plays a significant role in the machining process. The cutting edge of solid carbide end mills have some micro-defects after grinding. For eliminating aforementioned problem, this study investigates drag finishing (DF) preparation for solid carbide end mills reconstruct cutting edge micro-geometry. This paper is to present the design of DF experimental set-up and analysis the characterization of various abrasive media (K3/600, K3/400, HSC 1/300 and HSO 1/100) on the evolution of the surface /roughness along the cutting edge. In parallel, the mechanism of material removal and the kinematics trajectory of the drag finishing are presented. In fact, the form factor (also called as "K-factor") of the cutting edge micro-geometry is quantified. Comparing with four lapping media, the higher material removal rate (MRR) and the lower surface roughness are obtained by HSO 1/100 abrasive process. The results show that the cutting edge K-factor, MRR and surface topography are influenced by the abrasive particles size, composition and process time. The cutting edge micro-geometry is measured through Scanning Electron Microscopy (SEM) and 3D Optical measuring instrument.

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Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics

Cited by 38 publications

References 63 publications

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Exploring the nano-polishing mechanisms of Invar

Analysis of abrasives on cutting edge preparation by drag finishing

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