Material Model and Simulation of Multilayer-AgSn-Foils for Transient-Liquid-Phase Bonding of Sensor Elements

Feist, Markus; Liu, Cong; Wilde, Jürgen

doi:10.1109/eurosime.2019.8724544

Cited by 2 publications

(4 citation statements)

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“…where s o is the initial yield stress; R o and R 1 are the linear and exponential terms coefficients (in stress units); b is the exponential saturation parameter; and e p is the equivalent plastic strain. works of the authors (Feißt et al, 2019a(Feißt et al, , 2019bFeisst, 2023) and plugged into the FEA models of the PCB and DCB substrate to simulate the TLP layer response due to temperature loading profile. It is important to emphasize that such literature-based material coefficients, listed in Table 4, were measured using the same tensile testing setup and conditions discussed in the present paper and obtained for the same multilayer AgSn TLP foil configurations.…”

Section: Stress-strain Relationshipsmentioning

confidence: 99%

“…Silicon (Hull, 1999) Copper (Gharaibeh and Al-Oqla, 2023) FR4 (Gharaibeh and Al-Oqla, 2023) Al 2 O 3 (Wang et al, 2001) AgSn TLP (Feißt et al, 2019a(Feißt et al, , 2019b Elastic prone to earlier failures when they are used on the PCB substrates.…”

Section: Mechanical Propertymentioning

confidence: 99%

“…The AgSn-TLP configuration, indeed, offers one major advantage is that it produces on two IMC phases, Ag 3 Sn (e-phase) and Ag 5 Sn (z-phase) and exhibits a tendency for Kirkendall void during the IMC (Ag 3 Sn ! z) transformation (Lis and Leinenbach, 2015;Mokhtari, 2019;Moeini et al, 2014;Feißt et al, 2019aFeißt et al, , 2019b. This ends up with a relatively high melting point of the AgSn TLP bonds (Sun et al, 2020;Rheingans et al, 2022).…”

Section: Introductionmentioning

confidence: 99%

“…Feißt et al (2019a), 2019b used tensile tests and optical measurements to investigate the elastic–plastic mechanical properties of nine-layer AgSn TLP foils and produced a bilinear isotropic hardening material models for the temperature range of 25°C–200°C. In their model, they estimated the elastic and tangent moduli as well as yield and ultimate tensile strengths of the AgSn-TLP bonds.…”

Section: Introductionmentioning

confidence: 99%

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Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Gharaibeh,

Feisst,

Wilde

2024

SSMT

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Purpose This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils. Design/methodology/approach The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads. Findings The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints. Originality/value In literature, there is no constitutive modeling data on the AgSn TLP bonds.

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Section: Stress-strain Relationshipsmentioning

confidence: 99%