Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Abstract

Purpose This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils. Design/methodology/approach The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads. Findings The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints. Originality/value In literature, there is no constitutive modeling data on the AgSn TLP bonds.

A study on the thermomechanical response of various die attach metallic materials of power electronics

“…strains, are much lower for both joint configurations, suggesting brittle behavior. In fact, this was observed by Gharaibeh et al (2023) for the AgSn-TLP bonds. Such bonds showed brittle failures for temperatures less than 150°C, and creep behavior is stated to become dominant at elevated temperatures (200°C).…”

“…Figure1Finite element model details of the current DCB electronic assembly(Gharaibeh and Wilde, 2023) …”