Material issues in electronic interconnects and packaging

Subramanian, K. N.; Lee, A.; Choi, S.; Sonje, P.

doi:10.1007/s11664-001-0046-7

Cited by 17 publications

(3 citation statements)

References 17 publications

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“…The lead has been traditionally used in solder alloys and despite its superior mechanical properties, there has been environmental and health concerns due to the innate toxicity of lead [1,2]. Following this matter, utilizing elements that are non-hazardous to the human body and environment is essential.…”

Section: Introductionmentioning

confidence: 99%

Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys

Amin

Shnawah

Sabri

et al. 2014

AMR

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This paper reports on the effect of Fe addition in the range of 0.1 wt.% to 0.5 wt.% on the electrical resistivity of the Sn-1Ag-0.5Cu (SAC105) solder alloy. The electrical resistivity is characterized by the four-point probe technique. Results showed that the Fe-bearing SAC105 solder alloys exhibit lower electrical resistivity compared with the standard SAC105 solder alloy. Moreover, the electrical resistivity further decreases with increasing the amount of Fe addition. As Fe is a low-cost and non-hazardous element, along with the high mechanical reliability, the Fe-bearing SAC105 solder alloys also demonstrate good electrical characteristics, and hence may be an attractive candidate for a low cost, reliable formulation for lead free solders in electronics packaging.

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Section: Introductionmentioning

confidence: 99%

Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys

Amin

Shnawah

Sabri

et al. 2014

AMR

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“…Some potential replacements include Sn-Ag and Sn-Ag-Cu solders. 2 However a sufficiently extended knowledge of the mechanical behavior and reliability of Sn-rich lead-free solders is not yet available. 3 A particularly critical aspect is reliability at high service temperatures.…”

Section: Introductionmentioning

confidence: 99%

A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Sivasubramaniam

Galli

Janczak‐Rusch

et al. 2009

Journal of Elec Materi

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The current study proposes a combined experimental and modeling approach to characterize the mechanical response of composite lead-free solders. The influence of the reinforcement volume fraction on the shear response of the solder material in the joint is assessed. A novel optimized geometry for single lap shear specimens is proposed. This design minimizes the effect of plastic strain localization, leading to a significant improvement of the quality of experimental data. The constitutive model of the solder material is numerically identified from the load-displacement response of the joint by using inverse finite element identification. Experimental results for a composite solder with 0.13 reinforcement volume fraction indicate that the presence of the reinforcement leads to a 23% increase of the ultimate stress and a 50% decrease of the ultimate strain. To interpret experimental data and predict the elastoplastic response of the composite solder for varying particle volume fraction, a three-dimensional (3D) homogenization model is employed. The agreement between experiments and homogenization results leads to the conclusion that the increase in the ultimate strength and the decrease in ductility are to be attributed to load sharing between matrix material and particles with the development of a significant triaxial stress state which restricts plastic flow in the matrix.

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“…However, alternatives for these solders are being sought due to environmental and economic issues. [1][2][3][4] One of the attractive leadfree solder candidates is tin-silver based solder because the reliability and mechanical properties are comparable to lead-tin solders. In high-temperature applications such as in automotive under-the-hood, aerospace, and military applications, eutectic tin-silver solder is appropriate due to its higher melting point.…”

Section: Introductionmentioning

confidence: 99%

Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints

Lee

Guo

Choi

et al. 2002

Journal of Elec Materi

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INTRODUCTIONLead-tin solders have been used extensively as joining materials for the interconnection and packaging in modern electronic components and devices over the past several decades. However, alternatives for these solders are being sought due to environmental and economic issues. 1-4 One of the attractive leadfree solder candidates is tin-silver based solder because the reliability and mechanical properties are comparable to lead-tin solders. In high-temperature applications such as in automotive under-the-hood, aerospace, and military applications, eutectic tin-silver solder is appropriate due to its higher melting point. However, this solder may not be appropriate in some industrial applications due to cost concerns. It was found that adding third or fourth alloy elements to tin-silver solder can depress the melting temperature or improve some physical/mechanical properties. There have been several studies to investigate the effects of adding alloying elements in enhancing the performance of eutectic tin-silver solder. [5][6][7] Solder joints in service conditions experience internal thermal stresses due to coefficients of thermal expansion mismatches between the component leads, solder, and the substrate. The thermomechanical fatigue (TMF) will occur due to such thermal stresses that develop during temperature excursions encountered during service. As a result, mechanical deformation will occur in the solder joints. There have been studies of TMF on lead-tin solder during the last decade. 8-11 However, additional data are needed on the TMF of lead-free solders.Studies have clearly documented a significant amount of surface damage resulting from TMF in Sn-Ag based solder joints. 2,12 Based upon the evolution of damages such as intense shear banding, solder joint surface upheaval, grain boundary sliding, and decohesion and surface cracking, degradation of residual strength of the solder joints due to TMF should be expected. Thus, an investigation of residual-mechanical properties of solder joints in TMF is essential to evaluate their reliability in microelectronic applications. There have been few studies dealing with residual strength of lead-free solder joints that have experienced TMF. [13][14][15] reported that eutectic Sn-3.5Ag and Sn-Ag-0.5Cu solders showed better mechanical properties than eutectic Sn-37Pb after 1600 TMF cycles with temperature extremes between Ϫ30°C and 130°C in quad flat pack leads. Poon et al. 14 investigated the Thermomechanical fatigue (TMF) due to the mismatch in coefficients of thermal expansion between solder and substrate gradually degrades the mechanical properties of electronic solder joints during service. This study investigated the role of TMF on the residual-mechanical behavior of solder joints made with eutectic Sn-Ag solder and Sn-Ag solder with Cu or Ni additions. The TMF tests were carried out between Ϫ15°C and ϩ150°C with a ramp rate of 25°C/min for the heating segment and 7°C/min for the cooling segment. The hold times were 20 min at the high extreme and 300 m...

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Material issues in electronic interconnects and packaging

Cited by 17 publications

References 17 publications

Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys

Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys

A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints

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