Material Characterization of Ti-Cu-Ni-Au(TCNA)-A New Low Cost Thin Film Conductor System

Morabito, J.M.; Thomas, J. H.; Lesh, N. G.

doi:10.1109/tphp.1975.1135074

“…The symmetric CPW transmission line is directly formed on the Si-substrate with Ti/Cu/Ni/Au as the electrode metals [8]. Without the use of thick insulation layer, the novel Si-based submount inherits the good thermal characteristics of Si substrate and the fabrication process is much simplified, as no additional thick dielectric-film deposition is required.…”

Section: Fabrication and Characteristics Of Novel Si-based Submountmentioning

confidence: 99%

Novel low-cost wideband Si-based submount for 40 Gb/s optoelectronic devices

Xiong

¹

,

Wang

²

,

Cai

³

et al. 2005

Microw. Opt. Technol. Lett.

1

0

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A novel low‐cost wideband Si‐based submount is proposed and fabricated for 40‐Gb/s optoelectronic devices. The submount contains a coplanar waveguide (CPW) for microwave‐signal feeding and a TaN thin‐film resistor for impedance matching. The CPW transmission line is directly formed on high‐resistivity Si substrate and exhibits a transmission loss as low as 0.165 dB/mm up to 40 GHz. Such a configuration has the advantage of a simplified fabrication procedure and efficient heat dissipation. As a demonstration, a high‐speed electroabsorption (EA) modulator is chip‐level packaged using the Si‐based submount. The small‐signal modulation bandwidth is measured to be more than 33 GHz, which is the first report of 40‐Gb/s optoelectronic devices on Si‐based submount. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 45: 90–93, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20733

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“…Numerous publications on different aspects of resistor fabrication and characterization have appeared in the literature during the past fifteen years. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] Conventionally a multilayer Ti-Pd-Au conductor system is used as the contact metallization for NiCr resistors. 11 In recent years due to increased cost of the precious metals a need for a low cost replacement metallization for the expensive Ti-Pd-Au has been realized.…”

Section: Introductionmentioning

confidence: 99%

Electrical properties of RF sputtered NiCr thin film resistors with Cu contacts

1984

Microelectronics Reliability

0

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Investigations on RF sputtered NiCr thin film resistors, fabricated using Cu as conductor metallization, were made. The contact resistance characteristics, resistor film characteristics and TCR of the resistors were measured. The effect of heat treatment on the resistor characteristics was studied. A suitable annealing cycle for the resistor stabilization was studied. A suitable annealing cycle for the resistor stabilization was obtained. The effect of passivation by a thin quartz film on the resistor properties was also examined. The results are presented and discussed in this paper.

show abstract

“…Numerous publications on different aspects of resistor fabrication and characterization have appeared in the literature during the past fifteen years. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] Conventionally a multilayer Ti-Pd-Au conductor system is used as the contact metallization for NiCr resistors. 11 In recent years due to increased cost of the precious metals a need for a low cost replacement metallization for the expensive Ti-Pd-Au has been realized.…”

Section: Introductionmentioning

confidence: 99%

Electrical Properties of RF Sputtered NiCr Thin Film Resistors With Cu Contacts

Nahar

¹

,

Devashrayee

²

1982

Active and Passive Electronic Components

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Investigations on RF sputtered NiCr thin film resistors, fabricated using Cu as conductor metallization, were made. The contact resistance characteristics, resistor film characteristics and TCR of the resistors were measured. The effect of heat treatment on the resistor characteristics was studied. A suitable annealing cycle for the resistor stabilization was studied. A suitable annealing cycle for the resistor stabilization was obtained. The effect of passivation by a thin quartz film on the resistor properties was also examined. The results are presented and discussed in this paper.

show abstract

Material Characterization of Ti-Cu-Ni-Au(TCNA)-A New Low Cost Thin Film Conductor System

Cited by 36 publications

References 10 publications

Novel low-cost wideband Si-based submount for 40 Gb/s optoelectronic devices

Novel low-cost wideband Si-based submount for 40 Gb/s optoelectronic devices

Electrical properties of RF sputtered NiCr thin film resistors with Cu contacts

Electrical Properties of RF Sputtered NiCr Thin Film Resistors With Cu Contacts

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