Material characterization of organic packaging materials to increase the accuracy of FEM based stress analysis

Boehme, Bjoern; Roellig, M.; Wolter, K.-J.

doi:10.1109/estc.2008.4684391

Cited by 6 publications

(3 citation statements)

References 1 publication

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“…In view of the characteristics of high-load impact during penetration, some scholars have adopted isolation measures to cushion protection measures. [10] and [11] found through finite element numerical simulation that viscoelastic polymer materials have a significant attenuation effect on stress as cushioning materials under impact loading. [12] used carbon fiber epoxy resin as a support plate to isolate electronic devices from the projectile, reducing stress and overload on the electronic devices during launch overload.…”

Section: Introductionmentioning

confidence: 99%

Analysis of the influence of different initial velocities on dynamic performance of multi-layer hard target penetration process

Liu,

Li,

et al. 2023

Front. Phys.

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To determine the overload characteristics of the internal system of a fuze that penetrates multilayer hard targets using different fixed-link structures, a finite element model consisting of two fixed-link structures (a compression screw and a body screw) is adopted in this paper to simulate the penetration process of a three-layer concrete target plate with corresponding initial velocities. The peak amplification coefficient and vibration coefficient are used to analyze the time-domain characteristics of the penetration process signal during segmented analysis. The extracted acceleration signals of the projectile and sensor are processed by fast Fourier transform to obtain the frequency spectrum analysis results. The simulation results show that under the same working conditions, the sensor’s ability to amplify the peak acceleration of the projectile is 17.77% higher for the body screw fixed-link structure, and the average vibration coefficient is also 9.55% higher. Compared with that of the body screw fixed-link structure, the performance of the compression screw fixed-link structure is better under different initial velocity conditions. The initial penetration velocity affects mainly the amplitude of each frequency corresponding to the acceleration signals of the two fixed-link fuze structure projectiles and sensors while having a relatively small influence on the frequency distribution position.

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Section: Introductionmentioning

confidence: 99%

Analysis of the influence of different initial velocities on dynamic performance of multi-layer hard target penetration process

Liu,

Li,

et al. 2023

Front. Phys.

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“…[9] studied the toughest workout of polyurethane foam to compressive power, which factored in temperature and the influence of density, strain rate, and strain. Researchers utilized viscoelastic equipment to defend digital systems during impact [10].…”

Section: Introductionmentioning

confidence: 99%

Influence of Microstructure on the Dynamic Behaviour of Polyurethane Foam with Various Densities

Boumdouha,

Louar

2023

J. Basic Appl. Sci.

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Polyurethane foam is reinforced with varying proportions of metal loads and other components to increase shock absorption and mechanical impact. The main objective is to develop high-performance polymeric materials based on polyurethane foam developed with different compositions and specific densities. We monitor the growth distances and temperatures of the polyurethane foam in time to reach the optimum formulations. We conduct static compression tests and investigate the effect of drop weight on the deformation of polyurethane foam structures by dropping a weight from a specified height. Dynamic collisions cause deformations of the polyurethane foam structure. After investigating the low weight, we found that polyurethane foams have a good absorption coefficient at certain frequencies. Dynamic stress-strain response curves are used to characterize different stress rates. High-stress levels and similar strains indicate a high resistance to shock. We follow the evolution of microstructure structures by scanning electron microscopy (SEM) to observe deformation and fracture behavior with reversibility and recovery.

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“…Such viscoelastic materials have been used by many researchers to protect embedded electronic systems under impact loads such as [4]- [6]. In [4] for instance, the authors have studied the stress distribution of a viscoelastic packaging structure using finite element (FE) tools under impact loads. The results were used to model the reliability of embedded systems.…”

Section: Introductionmentioning

confidence: 99%

Numerical modelling and optimization of an electronic system embedded in multi-layered viscoelastic materials under shock loads

Alsakarneh

Moore

Barrett

2011

2011 12th Intl. Conf. On Thermal, Mechanical &Amp; Multi-Physics Simulation and Experiments in Microelectronics and Microsystem

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Presented here is the use and optimization of mutli-Iayer viscoelastic buffer materials to protect embedded electronic systems from high mechanical forces such as impacts. The test vehicle was a solid sports ball, Figure 1. The embedded system was first encapsulated using standard epoxy encapsulant, then further encapsulated with two different buffer materials (a soft and a hard rubber) before the entire system was embedded in the ball. The ball (from the Irish game of hurling) has an original polyurethane/cork core encased in a leather outer skin and is 70 mm. in diameter and weighs 11 Og. The multi-layer buffering system reduces the imposed stress on the epoxy-encapsulated embedded system, so that the stress transmitted to the electronics is significantly reduced. From this point of view, the stress experienced at the embedded system edge was taken as the objective function to be minimized within the overall constraint that the modified ball must closely retain its original size, weight and "bounce" i.e. its Coefficient of Restitution (CoR). This is a specific example of the more general embedded systems problem of embedding, say, a system such as a wireless sensor node in a material or structure without significantly changing the material or structure mechanical properties and reliability. A numerical model, using ANSYS 11.0, was developed and used in a simulation-based designed experiment of eight runs. The element SOLlD92 was used to . m ? del the plastic and electronic structures. The optImIzed multilayered structure reduced the stress on the embedded system by 50% in comparison to the original un-buffered structure and reduced stress by 25% in comparison to the non-optimized buffer system. The optimized structure was within 90% of the original one for weight and 85 % for CoR. This work has defined a design methodology for buffer layers that significantly increase the protection of embedded electronic systems from high mechanical forces without major impact on the host object mechanical properties. The methodology is particularly applicable to the mechanical design of smart objects and structures.

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Material characterization of organic packaging materials to increase the accuracy of FEM based stress analysis

Cited by 6 publications

References 1 publication

Analysis of the influence of different initial velocities on dynamic performance of multi-layer hard target penetration process

Analysis of the influence of different initial velocities on dynamic performance of multi-layer hard target penetration process

Influence of Microstructure on the Dynamic Behaviour of Polyurethane Foam with Various Densities

Numerical modelling and optimization of an electronic system embedded in multi-layered viscoelastic materials under shock loads

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