2014
DOI: 10.1116/1.4886770
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Mass densification and defect restoration in chemical vapor deposition silicon dioxide film using Ar plasma excited by microwave

Abstract: Articles you may be interested inLow temperature direct bonding mechanisms of tetraethyl orthosilicate based silicon oxide films deposited by plasma enhanced chemical vapor deposition

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Cited by 4 publications
(2 citation statements)
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References 26 publications
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“…For example, at 500 mTorr, the Ar + ion content in the SAE case is approximately 18.3%, and that in the AAE case is around 23.4%. In the silane-argon mixed gas discharge, argon has several effects, including controlling the reaction rate of silane and bombarding OH bonds on the surface of SiO deposition [30][31][32]. Therefore, to achieve the desired effect at higher pressures, increasing the argon content in the AAE discharge may be necessary.…”
Section: Particle Transport and Deposition Rate In The Case Of Aae An...mentioning
confidence: 99%
See 1 more Smart Citation
“…For example, at 500 mTorr, the Ar + ion content in the SAE case is approximately 18.3%, and that in the AAE case is around 23.4%. In the silane-argon mixed gas discharge, argon has several effects, including controlling the reaction rate of silane and bombarding OH bonds on the surface of SiO deposition [30][31][32]. Therefore, to achieve the desired effect at higher pressures, increasing the argon content in the AAE discharge may be necessary.…”
Section: Particle Transport and Deposition Rate In The Case Of Aae An...mentioning
confidence: 99%
“…Therefore, in this paper, we present a systematic investigation of the EAE in an Ar/SiH 4 CCP driven by electrically asymmetric voltage waveforms (AAE and SAE) as a function of pressure. Gas mixtures, containing electropositive Ar and electronegative SiH 4 which are widely used in silicon-based film deposition applications [30][31][32], are concerned. The paper is structured as follows: section 2 contains a description of the fluid/electron Monte Carlo (MC) model and the reaction set considered in the model.…”
Section: Introductionmentioning
confidence: 99%