Manufacturing of sandwich structures for the integration of electronics in in mold labelling components

Wimmer, Annette; Reichel, Herbert; Rauch, Bernhard; Schramm, René; Hörber, Johannes; Habler, Bastian

doi:10.1109/icmid.2016.7738922

Cited by 10 publications

(4 citation statements)

References 1 publication

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“…In the literature, low-temperature solder was the material used to assemble the electrical components on PET foils [ 33 , 34 , 35 ]. However, we considered using conductive adhesive since it also cures in low-temperature conditions at 120 °C and the degradation process of PET at such temperature is relatively slow [ 36 ].…”

Section: Resultsmentioning

confidence: 99%

A Study on Over-Molded Copper-Based Flexible Electronic Circuits

et al. 2022

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Over-molding has been proposed in recent years as an integrated functional flexible circuit board in a plastic part. This method uses the conventional process for film insert technology. Over-molding has attracted significant attention across many industries due to its potential to deliver different electrical functions in a variety of different part geometries, especially in automotive interiors and home appliances. While it has great application potential, manufacturing challenges continue throughout foil fabrication and injection molding. This raises challenges for designers and researchers responsible for maintaining the reliability of such electronic flexible circuits. Therefore, the purpose of this research paper is to improve some of the over-molding process parameters. On 0805 and 1206 over-molded zero-ohm resistors, electrical, mechanical, and failure characterization was performed. Those components were mounted in parallel, perpendicular, and 45° angled arrangements on two different polymer substrates, polyimide (PI) and polyethylene terephthalate (PET) using lead-free solder, low-melt solder, and conductive adhesive paste. Moreover, as an over-molding material, polycarbonate (PC) with medium viscosity was used. The effect of using different mold shapes (corner mold, 2 mm flat mold, and 3 mm flat mold) and injection molding process parameters (injection speeds and melt temperature) was studied.

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Section: Resultsmentioning

confidence: 99%

A Study on Over-Molded Copper-Based Flexible Electronic Circuits

et al. 2022

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“…However, there were limited resources available to investigate the electronics behavior before and after the in-molding process. As a result, several researchers expressed interest in realizing the IME concept, by examining the impact of IME on different electronic packages, flexible foil materials, metallization, assembly methods, and mold shape to determine the effect of plastic materials on microsystems [84][85][86][87][88]. A summary is presented in table 8.…”

Section: In-mold Applications and Trendsmentioning

confidence: 99%

The integration of electronic circuits in plastics using injection technologies: a literature review

Bakr¹,

Bossuyt²,

Vanfleteren³

2022

Flex. Print. Electron.

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A great deal of attention has been paid in recent years to the integration of two and three-dimensional integrated electronic parts into plastics, both for their potential applications in modern human lives and for their outstanding properties, which include the ability to reduce product weight and space while increasing product reliability. The development of integrated electronic devices into plastics is advancing rapidly, owing to advancements in methodology and manufacturing techniques, which have significantly raised researcher interest in this topic. In-mold electronics (IME) is a term that describes an injection molding technology that integrates a printed foil with electrical components into a plastic part during the molding process. It is a revolutionary way to form two and three-dimensional products using electronic printed circuits. IME technology is comprised of three fundamental disciplines of study: electronics, materials science, and plastic manufacturing processes. Therefore, this review article aims to summarize the knowledge of these three primary fields to present an overview of in-mold technology. This article covers background history, a description of the In-mold process flow, and summarizes the recent real-life applications. Additionally, this article discusses some of the present technology challenges that must be overcome.

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“…Nevertheless, the combination of PTF conductor structures with conventional electronic components is still under development. Currently, only a few references deal with this crucial topic on the way to hybrid printed electronics [7][8][9][10][11][12][13][14][15]. In this paper we are going to present results of the Green Factory research project RUDiS II regarding hybrid printed electronics on planar molded substrates.…”

Section: Background and Motivationmentioning

confidence: 99%

Electrical Functionalization of Interconnect Devices by Digital Printing - Evaluation of Properties and Long-Term Behaviour

Schirmer

Roudenko

Reichenberger

2018

AMM

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Digital printing technologies are becoming increasingly important for modern electronics production. Besides inkjet printing for low viscosity inks, jetting of pasty materials such as PTF can be a viable alternative to traditional subtractive or additive metallization methods in the future. Hybrid printed electronics, a combination of printed circuitry with classical electronic components, offers many advantages such as low cost, environmental sustainability and others. Until now, the mechanical and electrical properties of printed pastes on molded substrates have not been investigated in detail, just as little as the long-term characteristics of interconnection technologies necessary to mount traditional electronic components onto printed substrates. In different test series, electrical resistance and adhesion of a special PTF material have been investigated. The long-term behavior of the material itself and three alternative interconnection technologies for mounting of SMT components has been evaluated. Results are encouraging, although still a lot of improvements are necessary.

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Manufacturing of sandwich structures for the integration of electronics in in mold labelling components

Cited by 10 publications

References 1 publication

A Study on Over-Molded Copper-Based Flexible Electronic Circuits

A Study on Over-Molded Copper-Based Flexible Electronic Circuits

The integration of electronic circuits in plastics using injection technologies: a literature review

Electrical Functionalization of Interconnect Devices by Digital Printing - Evaluation of Properties and Long-Term Behaviour

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