Electrical Functionalization of Interconnect Devices by Digital Printing - Evaluation of Properties and Long-Term Behaviour

Abstract

Digital printing technologies are becoming increasingly important for modern electronics production. Besides inkjet printing for low viscosity inks, jetting of pasty materials such as PTF can be a viable alternative to traditional subtractive or additive metallization methods in the future. Hybrid printed electronics, a combination of printed circuitry with classical electronic components, offers many advantages such as low cost, environmental sustainability and others. Until now, the mechanical and electrical properties of printed pastes on molded substrates have not been investigated in detail, just as little as the long-term characteristics of interconnection technologies necessary to mount traditional electronic components onto printed substrates. In different test series, electrical resistance and adhesion of a special PTF material have been investigated. The long-term behavior of the material itself and three alternative interconnection technologies for mounting of SMT components has been evaluated. Results are encouraging, although still a lot of improvements are necessary.