Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes

Schirmer, Julian; Eisen, Kilian; Reichenberger, Marcus; Roudenko, Jewgeni; Neermann, Simone; Franke, Jörg

doi:10.1109/icmid.2018.8526939

Cited by 3 publications

(6 citation statements)

References 10 publications

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“…This was also accompanied by a significant reduction in the variance for all substrate and interconnect technologies. As already mentioned, a typical reduction of the resistivity of thick film pastes in past investigations was around 10% [11,19]. The significantly stronger resistivity reduction observed here could be explained by penetration of the spring loaded contacts (and thus increase of the contact area) in combination with the reduction of the paste resistivity by post-curing.…”

Section: Discussionsupporting

confidence: 74%

“…For level 2 interconnects, contacts are mostly realized by means of soft solder and conductive adhesives. For these nondetachable types of interconnects, even on printed electronics, a small number of publications can be found [11][12][13][14][15][16][17][18]. More often, epoxy based isotropic conductive adhesives are used to create those level 2 interconnects [11][12][13][14][15][16][17][18].…”

Section: Background and Motivationmentioning

confidence: 99%

“…For these nondetachable types of interconnects, even on printed electronics, a small number of publications can be found [11][12][13][14][15][16][17][18]. More often, epoxy based isotropic conductive adhesives are used to create those level 2 interconnects [11][12][13][14][15][16][17][18]. In [12] it has been shown that the electrial resistances as well as the long-term behaviour of such interconnects on printed conductor patterns are comparable to those on conventionally etched printed circuit boards [12,13].…”

Section: Background and Motivationmentioning

confidence: 99%

“…Notwithstanding most applications use conductive adhesives to interconnect electronic components, the possibility to solder printed structures is also a research topic. In [11] for example, the solderability (using SnBiAgsolder) of SMD devices on screen-printed silver structures is investigated, resulting in good weting of the printed thick film (PTF) paste by the solder. It was shown here that low-temperature solder materials can also provide good wetting and long-term stability on printed electronics.…”

Section: Background and Motivationmentioning

confidence: 99%

See 3 more Smart Citations

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Schirmer¹,

Hümmer²,

Klauß³

et al. 2021

Flex. Print. Electron.

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Hybrid printed electronics (HPE) combines advantages of conventional electronics manufacturing technologies such as surface mount technology with those of printed electronics in order to realize more complex electronic systems. To realize the final product, such HPE subassemblies have to be connected to higher-level assemblies. So far interconnection techniques for the so-called level 3 interconnection between printed subsystems and standard electronics have not yet been considered adequately in scientific research. In this paper, alternative detachable level 3 interconnection technologies, i.e. spring loaded contact pins, zero insertion force (ZIF) as well as Non-ZIF connectors are investigated systematically regarding their electrical behaviour against the background of printed electronics. Screen-printed silver filled polymer thick film paste is used to realize printed conductor patterns on flexible polymer substrates, which are connected later on with the alternatives mentioned above. Transition resistance is measured using the four wire method as produced, after repeated mating cycles as well as after accelerated aging tests. The various electrical contacts are subjected to thermal stress in temperature cycling testing and during aging at a constant high temperature. As a result it can be stated, that the sping-loaded contact pins used in this investigation show superior behavior compared with the selected connectors in terms of resistance increase after mating cycles. Concerning long-term behavior after thermal cyling and high temperature storage, all investigated alternaives reveal convincing results.

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Section: Discussionsupporting

confidence: 74%

Section: Background and Motivationmentioning

confidence: 99%

Section: Background and Motivationmentioning

confidence: 99%

Section: Background and Motivationmentioning

confidence: 99%

See 2 more Smart Citations

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Schirmer¹,

Hümmer²,

Klauß³

et al. 2021

Flex. Print. Electron.

Self Cite

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show abstract

“…Schirmer et al [25] investigate the shear strength of vapor phase soldered interconnections before and after different aging tests. Unaged solder interconnections show an average shear strength of approx.…”

Section: Background and Motivationmentioning

confidence: 99%

Mechanical characterization of solder interconnections on functionalized, copper-containing polymer thick-film pastes for hybrid integration

Hümmer

Roudenko

Wenger

et al. 2022

Flex. Print. Electron.

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In this work, on different substrate materials thermally cured polymer thick-film pastes are connected to Surface Mount Technology resistors using a SnBiAg solder alloy. The effect of substrate pre-treatment with atmospheric plasma and thermal cycling on the shear strength of these interconnection is investigated, and the shear forces obtained are graded using MIL-STD 883. In particular, the build-up of solder interconnections on conductive structures made of commercially available copper-containing polymer thick-film pastes and their mechanical characterization is novel. As well as the mechanical characterization of conductive structures, made of polymer thick-film, on plasma-treated substrates and their grading using the MIL-STD 883. In addition, interconnections with silver-containing conductive structures are realized for comparison. Depending on the interconnection system, component mean shear forces of up to 31 N are achieved. While some systems meet the 1.25 x criterion of MIL-STD 883, the majority of the systems investigated do not meet the 1.00 x criterion. Hereby, the adhesion between the conductive structure and the substrate usually fails. Plasma pre-treatment shows an adhesion-increasing effect only for a proportion of substrate materials used, as does thermal aging. Thermal loads can also impair the adhesive strength.

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Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics

Schirmer

Reichenberger

Wimmer³

et al. 2021

2021 14th International Congress Molded Interconnect Devices (MID)

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Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes

Cited by 3 publications

References 10 publications

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Mechanical characterization of solder interconnections on functionalized, copper-containing polymer thick-film pastes for hybrid integration

Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics

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