Manufacturing of nanostructures with high aspect ratios using soft UV-nanoimprint lithography with bi- and trilayer resist systems

Handte, Thomas; Scheller, Nicolas; Dittrich, Lars; Thesen, Manuel W.; Messerschmidt, Martin; Sinzinger, Stefan

doi:10.1016/j.mne.2022.100106

Cited by 7 publications

(5 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this concept, we suggest to fabricate the diffractive microstructures with reduced requirements on the spatial complexity on regular MLAs, e.g. by imprint lithography [5].…”

Section: Discussionmentioning

confidence: 99%

Micro-diffractive optical element arrays for beam shaping

2022

View full text Add to dashboard Cite

We describe the design of Fourier type array generators and beam shapers as periodic configurations of refractive-diffractive optical elements in microscale to provide specific beam shaping and imaging functionaliies. We investigate how the addition of micro-nanostructures to regular microstructure arrays enables new degrees of freedom for the design of micro-optical systems, in combination with adapted fabrication techniques yields a better optical performance and leads to enhancement of the array concept, uniformity and efficiency.

show abstract

“…In this concept, we suggest to fabricate the diffractive microstructures with reduced requirements on the spatial complexity on regular MLAs, e.g. by imprint lithography [5].…”

Section: Discussionmentioning

confidence: 99%

Micro-diffractive optical element arrays for beam shaping

2022

View full text Add to dashboard Cite

show abstract

“…The so formed isotropic etch enabled a lift-off after electron beam evaporation of Al (thickness 40nm) using a standard stripper (DMSO) in an ultrasonic bath, resulting in a nano-scaled metal mesh (see figure 2). [6] Similar approaches has been used in the fabrication of metal particles. [7] figure 2 SEM images of the bilayer stack after metal deposition (left) and lift-off (right).…”

Section: Nano-scaled Metal Etch Mask Via Lift-off (Route B)mentioning

confidence: 99%

“…[7] figure 2 SEM images of the bilayer stack after metal deposition (left) and lift-off (right). [6] Alternatively, a dry etch process can be applied. Here, an etch stop layer is necessary that can be, a SiO2 layer is that is prepared via chemical vapor deposition procedure.…”

Section: Nano-scaled Metal Etch Mask Via Lift-off (Route B)mentioning

confidence: 99%

Novel multi-layer nanoimprint lithography material system enabling nano-patterning of functional optical layers

Messerschmidt,

Lohse,

Heidensohn

et al. 2024

Novel Patterning Technologies 2024

View full text Add to dashboard Cite

The use of imprint resists in the frame of a multi-layer systems is a viable and also very effective approach to overcome critical challenges typically associated with the patterning and fabrication of demanding nano-patterned substrates like high-aspect ratio structures often applied e.g. in optical devices. The high etch performance of the systems needed for such pattern transfers is either realized by the fabrication of in situ etch masks or by the preparation of a metal hard mask after the imprint and subsequent etch processes. While it might seem counterintuitive at first glance, to split the different features and functions of one resist into different materials and layers, the overall fabrication process however becomes more inherent robust and is moreover also easier adaptable to changes and modifications like e.g. the use of other substrate materials). Herein, we present in detail different types of multi-layer material systems that are all realized by applying candidates of the mr-NIL210 resist series.

show abstract

“…Lift-off methods are an important step for pattern transfer or etch mask definition in nanofabrication [1,2]. These can be described as processes where a substrate is covered with a resist layer for pattern definition, which undergoes a lithography or printing step.…”

Section: Introductionmentioning

confidence: 99%

“…This makes lift-off processes a useful step in micro or nanofabrication where a high precision definition of a pattern is required. Processes like these can be of a complicated nature with many different layers to enable the desired end result [1,3]. For a simplified approach, single layer lift-off processes have been investigated in an attempt to streamline printing and pattern transfer without loss of quality or pattern integrity.…”

Section: Introductionmentioning

confidence: 99%

Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns

2023

View full text Add to dashboard Cite

Lift-off processing is a common method of pattern transfer for different nanofabrication applications. With the emergence of chemically amplified and semi-amplified resist systems, the possibilities for pattern definition via electron beam lithography has been widened. We report a reliable and simple lift-off process for dense nanostructured pattern in CSAR62. The pattern is defined in a single layer CSAR62 resist mask for gold nanostructures on silicon. The process offers a slimmed down pathway for pattern definition of dense nanostructures with varied feature size and an up to 10 nm thick gold layer. The resulting patterns from this process have been successfully used in metal assisted chemical etching applications.

show abstract

Manufacturing of nanostructures with high aspect ratios using soft UV-nanoimprint lithography with bi- and trilayer resist systems

Cited by 7 publications

References 29 publications

Micro-diffractive optical element arrays for beam shaping

Micro-diffractive optical element arrays for beam shaping

Novel multi-layer nanoimprint lithography material system enabling nano-patterning of functional optical layers

Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns

Contact Info

Product

Resources

About