Manufacturing Equipment Issues in Rapid Thermal Processing11Based in part on an invited presentation at the SPIE Workshop on Rapid Thermal and Integrated Processing, San Jose, California, September 9, 1991.

Roozeboom, F.

doi:10.1016/b978-0-12-247690-7.50012-3

Cited by 16 publications

(1 citation statement)

References 104 publications

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“…After a decade of intensive research, rapid thermal processing (RTP) has emerged as an indispensable semiconductor manufacturing processes. The main advantage of RTP over the conventional furnace process is that various wafer manufacturing operations such as annealing, oxidation, nitridation, chemical vapor deposition, and cleaning can be conducted in a single system with reduced thermal budget, enhanced wafer granularity, and cluster compatibility . Despite the great promise, the widespread application of RTP has been slowed by the difficulty of attaining a required level of uniformity in the temperature distribution across the wafer surface.…”

Section: Introductionmentioning

confidence: 99%

Control of Wafer Temperature Uniformity in Rapid Thermal Processing Using an Optimal Iterative Learning Control Technique

Lee

Chin

et al. 2001

Ind. Eng. Chem. Res.

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An iterative learning control (ILC) technique based on a quadratic optimal criterion is proposed for temperature uniformity control of a wafer under rapid thermal processing (RTP). The proposed technique is based on a time-varying linear state space model which approximates a nonlinear system along a reference trajectory. For effective use of feedback measurements, it employs a periodically time-varying Kalman filter which is based on an augmented model capable of describing the transition behaviors from one run to next, as well as those from one sample time to another. By retaining the relevant information from previous runs in the Kalman state, the control technique is able to make improvements in the control performance from one run to the next and eventually to converge to a minimum-achievable tracking error despite model error. A simple but effective method for identifying a time-varying linear state space model for the RTP system is also proposed. The performance of the proposed technique is evaluated through a simulation study involving the RTP model processing 8-in. silicon wafers.

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Section: Introductionmentioning

confidence: 99%