Manipulating the Crystallographic Texture of Nanotwinned Cu Films by Electrodeposition

Chan, Tsung-Cheng; Chueh, Yu‐Lun; Liao, Chien-Neng

doi:10.1021/cg200877f

Cited by 44 publications

(33 citation statements)

References 22 publications

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“…Increase in (101) with the extent of self-annealing and at very low deposition rates was reported to be because of higher off-times 33 . Further due to lesser atomic density in the plane and high broken bonds, (101) is known to be dissolved more easily compared to (111) and (100) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 deposition (Table 1).…”

Section: Texture Validation By Ebsd and Xrdmentioning

confidence: 99%

“…Numerous research efforts have been devoted towards the preparation of copper foils with high hardness and electrical conductivity. As part of these studies, highly textured and twinned copper foils with enhanced mechanical and electrical properties were synthesized by electrodepositionusing DC and PED techniques 23,[30][31][32][33][34][35][36][37] (various reports on usage of DC and PED to deposit copper in various forms with varied microstructure and texture are summarized in supporting information).…”

Section: Introductionmentioning

confidence: 99%

“…However, literature suggests the use of organic additives in the electrolyte in order to achieve grain refinement, formation of twin boundaries/to control the texture and surface modifications 30,33,[38][39][40][41][42] . Also, use of additives has been shown to manipulate the texture and the mechanical properties 33 .…”

Section: Introductionmentioning

confidence: 99%

“…Also, use of additives has been shown to manipulate the texture and the mechanical properties 33 . However, stresses introduced by additives result in reducing the deposit ductility and increase the scattering of electrons leading to decrease in the electrical conductivity.…”

Section: Introductionmentioning

confidence: 99%

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Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Pavithra

Sarada

Rajulapati

et al. 2015

Crystal Growth & Design

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The texture evolution in copper foils prepared by a rapid pulse reverse electrodeposition (PRED) technique using an 'additive-free' electrolyte and the subsequent correlation with the mechanical and electrical properties is investigated in the present study. Control over (111), (100) and (101) crystallographic textures in copper foils has been achieved by optimization of the pulse parameters and current density. Hardness as high as 2.0-2.7 GPa, while maintaining the electrical conductivity in the same range as that of bulk copper was exhibited by these foils. The complete study of controlling the (111), (100) and (101) textures, CSL Σ3 coherent twin boundaries, grain refinement and their effect on the mechanical and electrical properties is performed in detail by characterizing the foils with electron backscatter diffraction (EBSD), X-ray diffraction (XRD), nanoindentation and electrical resistivity measurements. PRED technique with short and high energy pulses enabled the (111) texture while increasing the forward off-time with optimized current density resulted in the formation of (100) and (101) textures. The reverse/anodic pulse applied after every forward pulse aided the minimization of residual stresses with no additives in the electrolyte, stability of texture in the foils, grain refinement and formation of growth-twins.Among the three highly textured copper foils, those with dominant (111) texture exhibited a lower electrical resistivity of ~1.65×10 -6 Ω-cm and better mechanical strength compared to those with (100) and (101) textures.

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Section: Texture Validation By Ebsd and Xrdmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Pavithra

Sarada

Rajulapati

et al. 2015

Crystal Growth & Design

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show abstract

“…[1][2][3] As the dimensions of electronics have been continually reduced to the nanoscale range, the development of new conducting materials with improved electrical conductivity and enhanced electromigration resistance and mechanical strength are now needed to achieve high-speed and reliable electronic microprocessors. [4][5][6][7][8] The introduction of a secondary metal to Cu is one of the candidate approaches against electromigration and mechanical stress. [9][10][11][12] Since the co-deposited secondary metal increases the probability of electron scattering, the reduction of electrical conductivity is an inevitable corollary with co-deposited metal.…”

mentioning

confidence: 99%

Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film

Kim

Park

Lim

et al. 2013

J. Electrochem. Soc.

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The dimensions of Cu interconnections in electronic devices have been rapidly reduced to achieve high integration. The continual down scaling considerably increases both the electrical resistivity and the probability of electromigration failure. The addition of a secondary metal into Cu can improve the resistance against electromigration. However, the co-deposition of a secondary metal inevitably reduces the electrical conductivity. Thus, the main consideration in alloying with Cu is to find a secondary metal that shows the lowest resistivity. Ag has been known as the most appropriate. In this research, the superfilling of Cu-Ag and its mechanism are investigated. The area reduction at the surface with negative curvature induces the accumulation of adsorbed accelerators, finally resulting in local increment of the deposition rate of Cu-Ag at the bottom of a trench. Additionally, the microstructure of Cu-Ag film is investigated, and it is confirmed that Cu-Ag film exhibits superior oxidation resistance and mechanical strength without severe deterioration of the electrical conductivity compared to pure Cu.Cu has been widely used to fabricate the metal interconnections in various electronic devices through the damascene process, which involves the deposition of an intermetallic dielectric, the patterning of trenches or vias through lithography, the deposition of diffusion barrier and Cu seed layers, the electrodeposition of Cu, and chemical mechanical planarization (CMP) in sequence. 1-3 As the dimensions of electronics have been continually reduced to the nanoscale range, the development of new conducting materials with improved electrical conductivity and enhanced electromigration resistance and mechanical strength are now needed to achieve high-speed and reliable electronic microprocessors. 4-8

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Grain boundary character distribution in electroplated nanotwinned copper

et al. 2016

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Manipulating the Crystallographic Texture of Nanotwinned Cu Films by Electrodeposition

Cited by 44 publications

References 22 publications

Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film

Grain boundary character distribution in electroplated nanotwinned copper

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