2020
DOI: 10.1016/j.jechem.2020.03.082
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Making fully printed perovskite solar cells stable outdoor with inorganic superhydrophobic coating

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Cited by 22 publications
(19 citation statements)
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“…Successful encapsulation typically does not result in significant changes of efficiency after encapsulation. , For example, ∼19.2% average efficiency was obtained for 16 cells before and after encapsulation, with the best device exhibiting 19.9% PCE efficiency before 19.7% efficiency after encapsulation . In tandem cells, some drop in the efficiency can occur after encapsulation due to front glass reflection, but this mechanism is not applicable to individual PSCs which are typically illuminated through the same glass substrate before and after illumination.…”
Section: Encapsulation Methods and Materials For Pscsmentioning
confidence: 99%
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“…Successful encapsulation typically does not result in significant changes of efficiency after encapsulation. , For example, ∼19.2% average efficiency was obtained for 16 cells before and after encapsulation, with the best device exhibiting 19.9% PCE efficiency before 19.7% efficiency after encapsulation . In tandem cells, some drop in the efficiency can occur after encapsulation due to front glass reflection, but this mechanism is not applicable to individual PSCs which are typically illuminated through the same glass substrate before and after illumination.…”
Section: Encapsulation Methods and Materials For Pscsmentioning
confidence: 99%
“…In addition to ALD, e-beam evaporation , and RF sputtering have been used for depositing protective inorganic thin films, while plasma enhanced chemical vapor deposition (PECVD) has been used for depositing CF film encapsulation . Air brush coating of hydrophobic zirconia films (several microns thick) was also reported …”
Section: Encapsulation Methods and Materials For Pscsmentioning
confidence: 99%
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“…reported the fully screen‐printed perovskite solar cells that could exhibit a performance of 22.8 mA cm −2 , 0.911 V, 0.753, and 15.64% for the short circuit current, open‐circuit voltage, fill factors, and power conversion efficiency, respectively. [ 206 ]…”
Section: Potential and Challenges Of 3d Printed Mlmm Electronicsmentioning
confidence: 99%