2020
DOI: 10.1016/j.apmt.2020.100824
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Magnetocuring of temperature failsafe epoxy adhesives

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Cited by 12 publications
(26 citation statements)
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“…Previous investigations on magnetocuring adhesives have reported adhesion strength of 2.9 MPa against ABS and a relatively low heating rate of 1.2 °C s −1 under an AMF of 140 Oe despite varying CNP loading and formulation. [1] The highest specific absorption rate (SAR) of 5 W.g −1 was achieved for Mn 0.7 Zn 0.3 Fe 2 O 4 /OA/BADGE particles at 140 Oe. Earlier investigations confirm that the magnetic properties (M s and T c ) increase with Mn content in Mn 1−x Zn x Fe 2 O 4 .…”
Section: Resultsmentioning
confidence: 96%
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“…Previous investigations on magnetocuring adhesives have reported adhesion strength of 2.9 MPa against ABS and a relatively low heating rate of 1.2 °C s −1 under an AMF of 140 Oe despite varying CNP loading and formulation. [1] The highest specific absorption rate (SAR) of 5 W.g −1 was achieved for Mn 0.7 Zn 0.3 Fe 2 O 4 /OA/BADGE particles at 140 Oe. Earlier investigations confirm that the magnetic properties (M s and T c ) increase with Mn content in Mn 1−x Zn x Fe 2 O 4 .…”
Section: Resultsmentioning
confidence: 96%
“…Magnetocuring of epoxy adhesives has been introduced as a promising novel technology to cure one-part epoxy adhesives under an alternating magnetic field (AMF). [1] This technology overcomes several limitations of current thermoset resins and snap-cure adhesives, especially with temperature sensitive substrates. [2] Only UV/visible transparent materials can be photocured [3] and the high capital costs of electron beam curing limit the application to coatings.…”
Section: Introductionmentioning
confidence: 99%
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