2002
DOI: 10.1109/tmag.2002.802126
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Magnetization reduction due to oxygen contamination of bias sputtered Fe/sub 35/Co/sub 65/ thin films

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Cited by 13 publications
(6 citation statements)
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“…The coercivities of CoFeNi films plated from the newly developed bath are lower than those for CoFe films obtained with vacuum techniques for recording head fabrication, which are around 20 to 60 Oe. 4,6 The optimal soft magnetic properties of CoFeNi thin films can be achieved only by optimizing their chemical composition, phase formation, grain sizes, and electroplating process.…”
Section: Effect Of On-time (T On )mentioning
confidence: 99%
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“…The coercivities of CoFeNi films plated from the newly developed bath are lower than those for CoFe films obtained with vacuum techniques for recording head fabrication, which are around 20 to 60 Oe. 4,6 The optimal soft magnetic properties of CoFeNi thin films can be achieved only by optimizing their chemical composition, phase formation, grain sizes, and electroplating process.…”
Section: Effect Of On-time (T On )mentioning
confidence: 99%
“…With increasing storage density, the need for recording heads to write on high-coercivity media at high frequencies has raised new requirements for the write-head material that cannot be met by Ni 80 Fe 20 . New soft magnetic materials with higher saturation flux density B s such as electroplated CoFe alloys, CoFeNi alloys, CoFeCu alloys, ,− other CoFe-based alloys, sputtered FeN films, , and other Fe-based alloys 43-45 have been developed.…”
Section: Introductionmentioning
confidence: 99%
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“…It is known that amorphous iron can suffer a large reduction in [7], which would account for the lower observed in the small grain samples (A1, A2). An alternative explanation is that the amorphous material between the grains is more susceptible to oxidation [8]. However, oxide layers would be expected to increase Hc, which does not occur.…”
Section: Resultsmentioning
confidence: 99%
“…Soft magnetic films with high moment are also widely used in modern electromagnetic devices, such as high-frequency field-amplifying components, versatile communication tools, and magnetic shielding materials in tuners [4]. Although numerous soft or high-B s magnetic films have been achieved nowadays via sputtering, evaporation, and casting, most of them cannot be applied to device fabrication due to the following reasons: low-deposition rate (usually <8Å/S) and high-internal stress films from sputtering [5], overly thick films (commonly > 1 mm) from casting, and coarse-grained films from evaporation [6]. In addition, most of the reported materials have limited B s of ≤2.1T (e.g., NiFe, FeCoNi films) [3].…”
Section: Introductionmentioning
confidence: 99%