Si02 insulator was fabricated by using Xe2* excimer lamp at room temperature. In this method, a mixrine of NF3 and 02 gases was employed as a reaction gas. When the NF3 and 02 gases were exposed to the Xe2* excimer lamp light NF3 and 02 gases inside the chamber where Si substrate was placed, SiFn and N02 were produced by photo-chemical reaction. The SiFn accumulates on the Si substrate, and Si02 is formed by oxidation reaction between SiFn and N02. Subsequently SiFn adheres onto the formed Si02 and again oxidizes by N02. These processes occur spontaneously, and on Si02 film is grown. Experimental conditions were NF3:02 = 10:1, the total gas pressure 330 torr, photo-chemical reaction time 5 minutes, and chain reaction time 5 minutes. The results of the film characterization were a Si02 film thickness of about 1500A, a refractive index of 1.38, specific resistance of 1.67* 1010 Q. cm and relative dielectric constant of 6.96.
INTRODUCTIONSi02 insulator is generally fabricated by a thermal oxidation of Si wafer. However, high temperature processing has disadvantages such as dopants diffusion and redistribution, material interaction and stress in the films [1,2]. When a Si substrate with an aluminum electrode is oxidized, the aluminum electrode on Si the substrate becomes an alloy because Si oxidation temperature is higher than the melting, point of aluminum. Low temperature processing is necessary to solve such problems. The use of photo CVD, plasma CVD and TICS/H20 CVD in low temperature processing were previously reported [3][4][5]; however, the production temperature is about 200°C and can not fabricate a transparent film. Recently,