Magnetically bistable actuator

Gray, G.D.; Kohl, Paul A.

doi:10.1016/j.sna.2004.10.027

Cited by 22 publications

(9 citation statements)

References 14 publications

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“…must be selected the better sensitivity or the better dynamic range depending on the interest of measurement to made). That must improve some actual sensors [12][13][14] or to open ways for new sensor development.…”

Section: Discussionmentioning

confidence: 99%

Study of helical induced anisotropy in amorphous ribbons for sensor applications

García

Maganto

Tremps

et al. 2011

Phys. Status Solidi C

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Amorphous samples with helical induced anisotropy show magnetization processes that can be controlled by applying a longitudinal magnetic field simultaneously with an alternating current flowing through the sample. By varying the current amplitude and the phase difference between current and applied field, a wide range of coercivity and susceptibility values can be achieved. This work shows that the apparent coercive field and the susceptibility can be controlled in amorphous ribbons with helical anisotropy. These characteristics make these samples very suitable for their application as sensor cores, magnetic amplifiers, variable reluctance transformer cores, etc (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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Section: Discussionmentioning

confidence: 99%

Study of helical induced anisotropy in amorphous ribbons for sensor applications

García

Maganto

Tremps

et al. 2011

Phys. Status Solidi C

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“…Many simple processes for flip chip assemblies at low costs have been developed (Zhong, 1999, 2001a, b; Wong et al , 2000; Palm et al , 2001; Faheem and Lee, 2004; Gray et al , 2005; Campabadal et al , 2006). There are many options to be selected for a particular application of flip chip technology.…”

Section: Flip Chipmentioning

confidence: 99%

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

Zhong

Tee²,

Luan³

2007

Microelectronics International

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PurposeThis paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.Design/methodology/approachOf the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.FindingsResearch on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.Research limitations/implicationsBecause of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.Originality/valueThis review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

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“…For RF MEMS, the large displacement could ensure effective isolation for the signal transformation for operation in the region of 10 GHz as reported in [10]. A variety of MEMS switches, including electrothermal [10], electrostatic [11], and electromagnetic [12,13,14,15,16,17,18,19,20], were reported. The electrothermal microswitch usually tends to respond slowly; as a result, its application is limited.…”

Section: Introductionmentioning

confidence: 99%

“…The electromagnetic microactuator mainly consists of the microcoil and the moving membrane, which were fabricated on different wafers, separately. Then, the permanent magnet, membrane, and microcoil were assembled by bonding or via a manual process [15,16,17,18,19,20]. …”

Section: Introductionmentioning

confidence: 99%

Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer

Miao

Dai

Huang

et al. 2016

Sensors

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This paper presents a bistable microswitch fully batch-fabricated on a single glass wafer, comprising of a microactuator, a signal transformer, a microspring and a permanent magnet. The bistable mechanism of the microswitch with large displacement of 160 μm depends on the balance of the magnetic force and elastic force. Both the magnetic force and elastic force were optimized by finite-element simulation to predict the reliable of the device. The prototype was fabricated and characterized. By utilizing thick laminated photoresist sacrificial layer, the large displacement was obtained to ensure the insulation of the microswitch. The testing results show that the microswitch realized the bistable mechanism at a 3–5 V input voltage and closed in 0.96 ms, which verified the simulation.

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Magnetically bistable actuator

Cited by 22 publications

References 14 publications

Study of helical induced anisotropy in amorphous ribbons for sensor applications

Study of helical induced anisotropy in amorphous ribbons for sensor applications

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer

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