Aerospace 2006
DOI: 10.1115/imece2006-14879
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Lumped Element Modeling of Piezoelectric Cantilever Beams for Vibrational Energy Reclamation

Abstract: In this paper, an accurate physical model of a piezoelectric cantilever beam that is suitable for multi domain simulations of the transducer for energy harvesting is presented. In a composite piezoelectric cantilever beam with a proof mass that is subjected to a base acceleration, a strain is developed in the structure that produces a voltage due to the piezoelectric effect. Subsequently, the piezoelectric composite is connected to an energy reclamation circuit that uses a flyback converter topology, to maximi… Show more

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Cited by 14 publications
(15 citation statements)
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“…3 is much less complex than a fully distributed electromechanical model, an even further simplified resonant model, shown in Fig. 4, is often used for energy harvesting modeling [5], [9], [10], [13], [15], [23]- [26]. This simplified resonant LEM resides completely within the electrical domain, unlike the full LEM in Fig.…”
Section: A Transducer Modelingmentioning
confidence: 97%
See 1 more Smart Citation
“…3 is much less complex than a fully distributed electromechanical model, an even further simplified resonant model, shown in Fig. 4, is often used for energy harvesting modeling [5], [9], [10], [13], [15], [23]- [26]. This simplified resonant LEM resides completely within the electrical domain, unlike the full LEM in Fig.…”
Section: A Transducer Modelingmentioning
confidence: 97%
“…2, and a pulsed resonant converter (PRC) power converter topology. Previous works have separately examined the modeling of the transducer beam [1], [13] and implementation of the PRC [11], [14]- [17]; however, the combined modeling of the two components with the intent of a coupled, system-level design has not been thoroughly explored. Varying degrees of system-level models have been developed for a number of power converter topologies [18]- [20]; however, this list does not include the PRC.…”
Section: Introductionmentioning
confidence: 99%
“…This can be done under the assumption that a perfect bond exists between the beam and the piezoelectric material [8].…”
Section: Mechanical Modelingmentioning
confidence: 99%
“…A large proof mass is designed and integrated at the end of the supporting beam to achieve a low resonant frequency and increase output power. The fabrication process is as shown in Figure 8 [20,21]: Grow thermal oxide on silicon on insulator (SOI) wafer.Sputter deposit Ti/Pt (bottom electrode), and Al (top electrode), spin coat sol-gel PZT piezoelectric layer.Pattern and etch electrode, PZT and SiO 2 layer, deep reactive ion etching (DRIE) Si device layer.Plasma enhanced chemical vapor deposition (PECVD) deposit oxide, pattern and etch via.Pattern and etch contact pads.DRIE from backside, dicing and releasing.…”
Section: Fabricationmentioning
confidence: 99%
“…A large proof mass is designed and integrated at the end of the supporting beam to achieve a low resonant frequency and increase output power. The fabrication process is as shown in Figure 8 [ 20 , 21 ]: Grow thermal oxide on silicon on insulator (SOI) wafer. Sputter deposit Ti/Pt (bottom electrode), and Al (top electrode), spin coat sol-gel PZT piezoelectric layer.…”
Section: Fabricationmentioning
confidence: 99%