LTCC triplexer for WiMax applications

Orlenko, D.; Sevskiy, G.; Kerssenbrock, T. v.; Heide, P.

doi:10.1109/eumc.2005.1608802

Cited by 17 publications

(7 citation statements)

References 6 publications

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“…These systems require multiplexers with compact size, low loss and high isolation [2]. Several types of multiplexers have been proposed [3][4][5][6][7]. In [3], a triplexer utilizing a microstrip network and three combined broadside and edge-coupled filters is presented.…”

Section: Introductionmentioning

confidence: 99%

A multilayered triplexer based on interdigital filter topology with PCB technology

Aksoy

Yildiz

2015

2015 IEEE MTT-S International Microwave Symposium

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A multilayer triplexer for multi-band wireless communication systems is presented. The triplexer utilizes multilayer matching networks and three interdigital filters. It has low insertion loss, good return loss and high isolation in each band. Board size is reduced by using a multilayer structure that can be built by standard printed circuit board fabrication process. Three bands with high selectivity are obtained in S band.A good agreement between simulation and measurement results is achieved.

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Section: Introductionmentioning

confidence: 99%

A multilayered triplexer based on interdigital filter topology with PCB technology

Aksoy

Yildiz

2015

2015 IEEE MTT-S International Microwave Symposium

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“…The fundamental frequencies of resonator 1 and 2, resonator 3 and 4, resonator 5 and 6, and resonator 7 and 8 are located at 3, 5, 7 and 9 GHz, respectively, where frequencies of the higher order resonant modes of each coupled resonator are higher than the four passband frequencies by controlling the parameters of SIR. The parameters of the BPF are summarized in Table I FBW M g g (4) where g are the element values of the lowpass prototype filter, and FBW is the fractional bandwidth. The coupling coefficients are then used to determine the gap D 12 (D 34 , D 56 , D 78 ) between the resonators.…”

Section: Introductionmentioning

confidence: 99%

“…Planar circuits are popular structures because they can be fabricated using printed circuit technology, and are suitable for commercial applications due to their low cost and compact size [1]. Therefore, modern planar microwave components or devices capable of operating at more than one frequency band will play an important role in integrating communication systems, such as the global system mobile communications (GSM) [2], the wireless local area network (WLAN) [3], and the wireless metropolitan area network air interface (WiMAX) [4]. Stepped impedance resonators (SIRs) are known that they can control the higher-order resonant frequency.…”

Section: Introductionmentioning

confidence: 99%

Design of a novel four-band microstrip bandpass filter using double-layered substrate

Hsu

2009

2009 IEEE MTT-S International Microwave Symposium Digest

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A novel four-band microstrip bandpass filter using double-layered structure is proposed. The basic components used to build the proposed filter are four pairs of stepped impedance resonators on the top metal layer and middle metal layer. The four pairs of resonators have different fundamental frequencies. The first and second fundamental frequencies are designed to operate at 3 and 5 GHz on the middle layer; the third and fourth fundamental frequencies are designed to operate at 7 and 9 GHz on the top layer. Due to cross-coupling effect, attenuation poles at both sides of the passbands can be created to improve the filter selectivity. The full-wave simulator IE3D is used to design the four-band bandpass filter and to calculate the coupling coefficients of the resonators.

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“…In order to meet current trends for multiband operation, compact multiplexers and front-end modules employing this high-integrated LTCC technology have been successfully developed by many research groups. LTCC diplexers for WLAN and GSM/DCS applications [1]- [3] and triplexers for tri-band operation such as WiMax and EGSM/DCS/PCS bands were reported [4]- [5]. In case of CDMA handsets, a power amplifier module integrated with a SAW duplexer has been implemented based on single LTCC substrate [6].…”

Section: Introductionmentioning

confidence: 99%

LTCC Front-end Modules for Multi-band Applications

Kim

Cho

Kang

et al. 2006

2006 European Microwave Conference

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This paper presents LTCC front-end modules for multi-band applications. A dual-band module composed of a diplexer, a CDMA SAW duplexer, and a GPS SAW filter for CDMA/GPS applications and a tri-band module employing PIN diodes for CDMA/GPS/PCS applications are implemented based on LTCC substrates. The measured results of the dual-band module show that the insertion loss is less than 2.4 dB and 3.5 dB in CDMA Tx and Rx bands, respectively. The insertion of GPS path is about 1.8 dB. The tri-band module provides an insertion loss of less than 0.8 dB and 1.1 dB in CDMA and PCS bands, respectively. The insertion of GPS path is about 0.4 dB. The overall size of both modules is only 4.5 mm x 3.2 mm.

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LTCC triplexer for WiMax applications

Cited by 17 publications

References 6 publications

A multilayered triplexer based on interdigital filter topology with PCB technology

A multilayered triplexer based on interdigital filter topology with PCB technology

Design of a novel four-band microstrip bandpass filter using double-layered substrate

LTCC Front-end Modules for Multi-band Applications

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