&lt;title&gt;Performance of a-Si:H photodiode technology-based advanced CMOS active pixel sensor imagers&lt;/title&gt;

2005

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While a-Si:H based elevated photodiode arrays hold the promise of superior performance and lower cost CMOS-based image sensors relative to those based upon crystalline silicon photodiodes, the one area where a-Si:H based sensor performance has not been as good is in image lag. This problem is only exacerbated by Staebler Wronski Effect induced junction degradation. Image lag is caused by residual charge from photocurrents trapped within the junction once the light source is removed and can be measured for several seconds, even under continuous applied reverse bias. It is seen both in constant and variable bias pixel architectures. However, by carefully controlling a-Si:H junction bias conditions, it is possible to significantly reduce these transient photocurrents. This article will describe how the photocurrent decay time exponent can be reduce by almost an order of magnitude. Finally the physical causes behind image lag in a-Si:H based photodiode arrays will be discussed.

Section: Methodsmentioning

confidence: 99%

Reduction of Residual Transient Photocurrents in A Si:H Elevated Photodiode Array Based Cmos Image Sensors

2005

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Leakage Current Behavior in Common I-Layer A-SI:H P-I-N Photodiode Arrays

2003

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Hydrogenated amorphous silicon photodiode arrays form the basis of monolithic threedimensional integrated circuit sensor technology. In these arrays, the intrinsic a-Si:H layer covers the entire area to maximize light collection. One technique by which the pixel diode is defined, is to pattern the bottom contact layer independently of the intrinsic layer. One of the most important characteristics of any diode array, however, is that the dark-state reverse bias leakage currents must be as low as possible to minimize diode noise. This study examines the leakage currents associated with the pixelated array. These structures are unique in that the edge of the diode is defined by the local electric field between diodes, rather than the physical surface of an a-Si:H film. The effect of the diode edge has been found to induce a field-dependent component to the reverse bias leakage current. For example, diodes with 5500Å i-layer, have a junction leakage of 14 to 20 pA/cm 2 , at 5.0 x 10 4 V/cm, while the pixel edge-dependent current component can be as high as 30 pA/cm 2 . In addition, it will be shown that the i-layer thickness and junction doping plays a key role in determining the behavior of the leakage currents.

Suppression of Staebler-Wronski Effect Induced Electrical Crosstalk in a-Si:H-Based Image Sensors

2004

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Hydrogenated amorphous silicon photodiodes have been considered for use in array-based image sensors. They promise to significantly reduce the size and cost of CMOS image sensors, while offering the promise of improved pixel sensitivity. However, Staebler-Wronski Effect (SWE) based electrical crosstalk degradation has been a major concern in their acceptance, due to degraded spatial contrast and color fidelity. Since the SWE is a fundamental mechanism of a Si:H, solutions to this issue must look to ways of mitigating the SWE on diode array performance rather than elimination of SWE. In order to study electrical crosstalk, a novel device structure that inhibits light from reaching portions of the a-Si:H/dielectric interface was designed and fabricated to directly measure interpixel leakage currents. Results from these structures indicate that edge leakage can be a significant contributing component to the measured signal. In addition, a CMOS-compatible structure to suppress electrical crosstalk was designed and fabricated. Results from these structures demonstrate suppression of crosstalk up to lateral electric fields of at least 2 x 104 V/cm. Such suppression is adequate for densely packed minimum-size pixel arrays. Aspects of the design and implementation of the structure will also be discussed.