2000
DOI: 10.1117/12.396503
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<title>Lucent Microstar micromirror array technology for large optical crossconnects</title>

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Cited by 77 publications
(37 citation statements)
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“…A variety of switches have been developed, based on arrays of pop-up mirrors [56], [57] and single-axis [58], [59] and dual-axis [60] torsion mirrors. Of these, the best known is the Lucent Wavestar (Wavestar is a trademark of Lucent Technologies) micromirror, which uses a self-assembled, linked mechanism to space the mirrors away from the substrate and hence allow a large turn angle [61].…”
Section: -D Structuresmentioning
confidence: 99%
“…A variety of switches have been developed, based on arrays of pop-up mirrors [56], [57] and single-axis [58], [59] and dual-axis [60] torsion mirrors. Of these, the best known is the Lucent Wavestar (Wavestar is a trademark of Lucent Technologies) micromirror, which uses a self-assembled, linked mechanism to space the mirrors away from the substrate and hence allow a large turn angle [61].…”
Section: -D Structuresmentioning
confidence: 99%
“…[10] Lucent Technologies has used a self-assembly technique that is driven by the residual stress in deposited thin films (Cr/Au on polysilicon) to raise two-axis polysilicon scanners (500 µm mirror diameter) to a fixed position 50 µm above the substrate. [11,12] The FREE-SPACE OPTICAL MEMS, WU, PATTERSON [13] Two-axis scanning is achieved by electrostatic force between the mirror and the quadrant electrodes on the substrate. Fan's scanner has a static optical scan range of 28°and a drive voltage of 70 V. Resonant frequency for the mirror was measured at 1.5 kHz.…”
Section: Scanners With Electrostatic Parallel-plate Actuatorsmentioning
confidence: 99%
“…Shortcomings of many existing approaches are the requirements of additional fabrication processes and actuators, the complicated process and the consumption of wafer area are the major limitations. To avoid the additional processes or actuators, the residual stress inherent in the thin film materials during fabrication has been exploited in [4] to construct the 3D devices.…”
Section: Introductionmentioning
confidence: 99%