<title>Failure analysis concepts for microelectronics technologies and manufacturing of the future</title>

A Systematic Framework of Equipment Maintenance and Service with Application to Wire Bonder

“…The results of RPN ratio for the four kinds of failure modes of the first bond process are to be computed by utilizing (2) and (3) with data from Table 1.The results of RPN ratio with respect to DPs for the four failure modes are calculated and obtained as shown in Figure 6. From Figure 6, the optimal decision and associated actions can be inferred.…”

“…The importance of maintenance function and its management has grown rapidly. As a matter of fact, some research efforts have been undertaken on the maintenance related issues in the semiconductor business through out the years [2,3]. For example, integration of failure analysis in microelectronics manufacturing process was proposed for cost reduction [2].…”

A framework of equipment maintenance and service with application to wire bonder

“…Today, with the increasing numbers and workload of wire bonders in a semiconductor business, customers are relying on suppliers to provide efficient and effective maintenance and service of wire bonder equipment. In engineering practice, integration of failure analysis in microelectronics manufacturing process was proposed for cost reduction [2]. In the research area, most of the researches have been established on developing general methods for the development and operation of maintenance system [3].…”