&lt;title&gt;Electrodeposition of 3D microstructures without molds&lt;/title&gt;

Maciossek, A.

doi:10.1117/12.251226

Cited by 11 publications

(7 citation statements)

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“…Recently, electroplating was used to produce tapered shanks in a single plating step [67, 68]. The use of a patterned seed layer enables creation of 3-D structures with varying thickness and the process was first reported by Maciossek [69]. …”

Section: Metal Wire Based Neural Probesmentioning

confidence: 99%

NeuroMEMS: Neural Probe Microtechnologies

Hajj-Hassan

Chodavarapu

Musallam

2008

Sensors

168

114

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Neural probe technologies have already had a significant positive effect on our understanding of the brain by revealing the functioning of networks of biological neurons. Probes are implanted in different areas of the brain to record and/or stimulate specific sites in the brain. Neural probes are currently used in many clinical settings for diagnosis of brain diseases such as seizers, epilepsy, migraine, Alzheimer's, and dementia. We find these devices assisting paralyzed patients by allowing them to operate computers or robots using their neural activity. In recent years, probe technologies were assisted by rapid advancements in microfabrication and microelectronic technologies and thus are enabling highly functional and robust neural probes which are opening new and exciting avenues in neural sciences and brain machine interfaces. With a wide variety of probes that have been designed, fabricated, and tested to date, this review aims to provide an overview of the advances and recent progress in the microfabrication techniques of neural probes. In addition, we aim to highlight the challenges faced in developing and implementing ultra-long multi-site recording probes that are needed to monitor neural activity from deeper regions in the brain. Finally, we review techniques that can improve the biocompatibility of the neural probes to minimize the immune response and encourage neural growth around the electrodes for long term implantation studies.

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Section: Metal Wire Based Neural Probesmentioning

confidence: 99%

NeuroMEMS: Neural Probe Microtechnologies

Hajj-Hassan

Chodavarapu

Musallam

2008

Sensors

168

114

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“…With a patterned seed layer, however, it is possible to apply voltage locally while leaving other regions with no material deposition (figure 4(a)). As demonstrated in [26], variation in thickness is possible by using controlled gaps in the seed layer. Once the electroplated material crosses each gap, the seed layer on the other side begins to plate as well (figure 4(b)).…”

Section: D Electroplating Processmentioning

confidence: 99%

“…To produce the center-lowered coils, a simple fabrication technique was developed based on a 3D electroplating process, requiring only one additional mask and no additional layers, and can also be easily integrated with other inductor improvement methods. The process is based on segmenting the electroplating seed layer in order to introduce stepped delays in the vertical plating progress [26], which has been previously utilized in other types of microstructures [27][28][29].…”

Section: Introductionmentioning

confidence: 99%

3D electroplated inductors with thickness variation for improved broadband performance

Tseng

Bedair

Lazarus

2016

J. Micromech. Microeng.

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The performance of an RF spiral inductor is based on the balance between ohmic losses in the outer turns and eddy current losses dominant in the inner turns where the magnetic field is the strongest. In this work, air-core spiral inductors with winding trace thicknesses decreasing towards the center are demonstrated, achieving quality factor improvement over a wide frequency range compared to uniform thickness inductors. A custom 3D copper electroplating process was used to produce spiral inductors with varying winding thicknesses in a single plating step, with patterned gaps in a seed layer used to create delays in the vertical plating. The fabricated center-lowered coil inductors were 80 nH within a one square millimeter area with thickness varying from 60 µm to 10 µm from outer to inner winding. Within the 16 MHz–160 MHz range, the center-lowered inductors were shown to have a maximum to minimum quality factor improvement of 90%–10% when compared to uniform thickness inductors with thicknesses ranging from 60 µm to 10 µm. Compared to the 20 µm uniform thickness inductor which has the optimal performance among all uniform thickness inductors in this frequency range, the center-lowered inductors were shown to achieve a maximum quality factor improvement of 20% at the edge frequencies of 16 MHz and 160 MHz, and a minimum quality factor improvement of 10% near the geometric mean center frequency of 46 MHz.

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“…In order to avoid extra processes and complicated control of the interelectrode spacing, we introduced a 3D electroplating process which is able to produce structures with certain thickness difference by a single process, as demonstrated by Maciossek [18]. It has been utilized to produce microstructures with lower aspect ratios, such as tapered microprobes [19], wedged-shape micro mirror electrodes [20] and inductors with thickness variation [21].…”

Section: Introductionmentioning

confidence: 99%

A precise spacing-control method in MEMS packaging for capacitive accelerometer applications

Liu

Qiu

et al. 2018

J. Micromech. Microeng.

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Capacitive micro accelerometers with high sensitivity have found wide applications in geophysics. Reducing the interelectrode spacing, which is determined by the thickness difference between the electrodes and the solder bumps in flip-chip eutectic bonding, is an efficient way to improve the sensitivity of area-varying capacitive transducers in micro accelerometers. Traditional methods require extra materials and processes, and precise control of the thickness of both the solder pumps and the electrodes is necessary. This work introduces a novel method for the precise control of the interelectrode spacing using a three dimensional (3D) electroplating process. Standoff pillars and electrodes are deposited by a single electroplating process with a constant thickness difference, which is only determined by the gap of the seed features that can be precisely determined by photolithography. The standoff pillars are used to define the thickness of the solder bumps in the packaging process. The 3D electroplating process is studied, characterized and applied to a typical high-precision micro capacitive area-varying accelerometer. Experimental results show that the variation of the interelectrode spacing is decreased by more than 6.5 times, when compared to that without the 3D electroplating process. Benefitting from the reduced interelectrode spacing, the sensitivity is increased by more than 3 times, while the resolution is 10 ng (√Hz)−1, which is 2.5 times better. It is believed that such a method can be applied to MEMS devices where interelectrode spacing needs to be precisely controlled.

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<title>Electrodeposition of 3D microstructures without molds</title>

Cited by 11 publications

References 0 publications

NeuroMEMS: Neural Probe Microtechnologies

NeuroMEMS: Neural Probe Microtechnologies

3D electroplated inductors with thickness variation for improved broadband performance

A precise spacing-control method in MEMS packaging for capacitive accelerometer applications

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