&lt;title&gt;Development of hybrid CMOS visible focal plane arrays at Rockwell&lt;/title&gt;

Bai, Yibin; Montroy, John T.; Blackwell, John D.; Farris, Mark; Kozlowski, Lester J.; Vural, Kadri

doi:10.1117/12.391730

Cited by 15 publications

(6 citation statements)

References 3 publications

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“…While modern CCD camera noise is dominated by output amplifier thermal noise (after the application of correlated double sampling in off-chip support circuits) or extraneous system noise due to inadequate device transimpedance to convert small photocurrents into usable voltage signals, CMOS-based imagers can provide lower temporal noise because each pixel can have a high-transimpedance amplifier whose noise-limiting bandwidth is several magnitudes smaller than the CCD output [9]. This advantage is also leading to the development of CMOS-based hybrids [10] that use either silicon detectors or alternative materials with optimized bandgap to reduce dark current, raise operating temperature and optimize the spectral bandpass…”

Section: Read Noisementioning

confidence: 97%

Large area visible arrays: performance of hybrid and monolithic alternatives

et al. 2002

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CMOS-based imaging system-on-chip (i-SoC) technology is successfully producing large monolithic and hybrid FPAs that are superior in many respects to competing CCD-based imaging sensors. The hybrid approach produces visible 2048 by 2048 FPAs with <6 e-read noise and quantum efficiency above 80% from 400 nm to 920 nm; 4096 by 4096 mosaics are now being developed. The monolithic approach produces visible 12-bit imaging system-on-chips such as a 1936 by 1088 with higher quantum efficiency than mainstream CCDs, <25 e-read noise, <0.02% fixed pattern noise, automatic identification and replacement of defective pixels, black-level clamping, total power dissipation of only 180 mW, and various programmable features. Several successors having ≥12 Mpixels are in development. In both cases low-light-level performance is boosted by coupling the sensors to image intensifiers.

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Section: Read Noisementioning

confidence: 97%

Large area visible arrays: performance of hybrid and monolithic alternatives

et al. 2002

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“…Conventional CMOS imagers, therefore, are fundamentally limited to extremely poor near-infrared response. For this reason the only inroads that CMOS can make into the astronomy market will be by hybrid devices, described in Section 5.2.1, in which a separate diode array, made on highresistivity silicon, is bump bonded to a CMOS readout multiplexer (MUX) (Bai et al, 2000). Whether this can be done in a cost-effective way remains to be seen.…”

Section: Ccd Vs Cmos: Process Comparisonsmentioning

confidence: 98%

“…The p-i-n detector array consists of a thick (∼185 μm) active region of high-purity silicon sandwiched between regions doped p-type and n-type (Bai et al, 2000). An example of this type of array is shown in Figure 25.…”

Section: Silicon P-i-n Detector Arraysmentioning

confidence: 99%

CCD Technology

Burke¹,

Jorden²,

Vu³

2006

Exp Astron

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Charge-coupled devices (CCDs) continue to reign supreme in the realm of imaging out to 1 μm, with the steady improvement of performance and the introduction of innovative features. This review is a survey of recent developments in the technology and the current limits on performance. Device packaging for large, tiled focal-plane arrays is also described. Comparisons between CCDs and the emerging CMOS imagers are highlighted in terms of process technology and performance.

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“…The size of the pixels is set by a number of considerations: (1) the minimum and maximum acceptable stored charge (dynamic range per pixel), (2) the requirement that we maximize the AΩ product, (3) sky noise limited operation with 10 sec exposures, (4) depth of focus (a consideration at near-IR where photons penetrate silicon), ( 5) maximize the near-IR QE (a pixel geometry constraint), (6) good performance in the near-IR, and (7) minimize device area in order to maximize yield. These demands jointly constrain the pixel size to about 10 microns.…”

Section: The Focal Plane Arraymentioning

confidence: 99%

Large Synoptic Survey Telescope: Overview

Tyson

2002

SPIE Proceedings

237

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A large wide-field telescope and camera with optical throughput over 200 m 2 deg 2 -a factor of 50 beyond what we currently have -would enable the detection of faint moving or bursting optical objects: from Earth threatening asteroids to energetic events at the edge of the optical universe. An optimized design for LSST is a 8.4 m telescope with a 3 degree field of view and an optical throughput of 260 m 2 deg 2 . With its large throughput and dedicated all-sky monitoring mode, the LSST will reach 24th magnitude in a single 10 second exposure, opening unexplored regions of astronomical parameter space. The heart of the 2.3 Gpixel camera will be an array of imager modules with 10 µm pixels. Once each month LSST will survey up to 14,000 deg 2 of the sky with many ∼10 second exposures. Over time LSST will survey 30,000 deg 2 deeply in multiple bandpasses, enabling innovative investigations ranging from galactic structure to cosmology. This is a shift in paradigm for optical astronomy: from "survey follow-up" to "survey direct science." The resulting real-time data products and fifteen petabyte time-tagged imaging database and photometric catalog will provide a unique resource. A collaboration of ∼80 engineers and scientists is gearing up to confront this exciting challenge.

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<title>Development of hybrid CMOS visible focal plane arrays at Rockwell</title>

Cited by 15 publications

References 3 publications

Large area visible arrays: performance of hybrid and monolithic alternatives

Large area visible arrays: performance of hybrid and monolithic alternatives

CCD Technology

Large Synoptic Survey Telescope: Overview

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