&lt;title&gt;Airborne chemical contamination of a chemically amplified resist&lt;/title&gt;

Macdonald, Scott; Clecak, Nicholas J.; Wendt, Hartmut; Willson, C. Grant; Snyder, Clinton D.; Knors, C.; Deyoe, N. B.; Maltabes, John G.; Morrow, James R.; McGuire, Anne; Holmes, Steven J.

doi:10.1117/12.46354

Cited by 100 publications

(45 citation statements)

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“…Again processing of the material was in accordance coworkers have identified certain air-borne bases as main contributors to this effect [11]. Experiments with our material confirm this result, but the sensitivity of our material seems to be much smaller, than that described by other research groups [12].…”

Section: Resolution and Focus Latitudesupporting

confidence: 69%

Chemical amplification & dissolution inhibition: a novel high performance positive tone deep UV resist.

Pawlowski¹,

Przybilla²,

Spieß³

et al. 1992

J. Photopol. Sci. Technol.

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The chemistry and some performance aspects of a novel chemically amplfled positive tone photoresist system sensitive to KrF excimer laser radiation is described. The material consists of three components: an a, a-bisarylsulfonyl diazomethane as the photoacid generator (PAG), an oligomeric N,0-acetal as the acid sensitive dissolution inhibitor (DI), and a poly(vinylphenol) as the hydrophilic matrix resin (MR). T e material combines high photospeed through the chemical ampl/1 cation mechanism with some properties of the conventional dissolution inhibition resist systems, such as standard processing and development conditions, excellent resolution, good contrast, favorable plasma etch stability, and easy stripping. Problems arising from the concept of chemical amplification, viz., delay time stability, formation of T-tops, and linewidth variation upon extended storage intervals are discussed, and first measures to their suppression will be presented. Some micrographs demonstrate the outstanding pattern quality of this newly developed resist material.

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Section: Resolution and Focus Latitudesupporting

confidence: 69%

Chemical amplification & dissolution inhibition: a novel high performance positive tone deep UV resist.

Pawlowski¹,

Przybilla²,

Spieß³

et al. 1992

J. Photopol. Sci. Technol.

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“…Figure 1 shows that no discernable linewidth change occurs over a 23 hour period. Unlike other CA resists, SNR248 does not require direct coupling of the imaging tool with post-exposure bake equipment, nor does it require environmental control during processing [2,3]. Latent image stability allows multiple cassette processing, and eases the burden of wafer processing from one work shift to the next.…”

Section: Methodsmentioning

confidence: 99%

Further Advances in Chemistry and Technology of Acid-Hardened Resists.

Allen

Calabrese

Lamola

et al. 1991

J. Photopol. Sci. Technol.

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This paper describes further developments of Acid Hardened Resist (AHR) systems, with particular focus on the DUV and i-line AHR resist performance. Results regarding the time delay between exposure and post-exposure bake are given for Megaposit®SNRT'248 photoresist over a 23 hour time delay, with no effect observed on the 0.5 µm linewidths. Li thographic performance for the i-line and DUV resists is also presented. Using i-line phase-shift mask technology 0.35 µm lines and spaces are printed with the i-line AHR resist. Finally, results are presented comparing the relative solubility of crosslinked resist films of SNR248 in tetrahydrofuran vs. various normality levels of tetramethylammonium hydroxide (TMAH). These results lead us to the conclusion that phenolic hydroxyl site blocking plays a role in dissolution inhibition in TMAH developers.

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“…The laser modulation amplitude has been chosen to maximise the PA signal for NH 3 at atmospheric pressure as in the experiments, thus corresponding to a modulation index (ratio of the frequency modulation amplitude to the width of the target absorption line) m = 2.2 for NH 3 . The same modulation depth has been considered for CO 2 , hence corresponding to a larger modulation index due to the smaller linewidth of the CO 2 line. The effect of the ambient pressure on the CO 2 and NH 3 signals has been considered in order to demonstrate that the proposed CO 2 -interference reduction scheme is not pressure sensitive.…”

Section: Co 2 and H 2 O Interference With Nhmentioning

confidence: 99%

“…In order to determine the equivalent NH 3 concentration due to the contribution of CO 2 and H 2 O, an average value of the corresponding PA signals measured at the centre of the NH 3 line was determined over 5 min (10 s integration time). Typical CO 2 Parameters of the strongest NH 3 and CO 2 lines around 1531.67 nm used in the simulations of the 2 f -PA signals according to the data from Webber et al [18] and Hitran [16] FIGURE 7 NH 3 , CO 2 and H 2 O measured spectra at 2 f . Interferences are calculated by measuring the contribution of CO 2 and H 2 O at the centre of the ammonia feature (0 GHz).…”

Section: Co 2 and H 2 O Interference With Nhmentioning

confidence: 99%

“…Sensitive and continuous ammonia (NH 3 ) monitoring is relevant in various applications, such as DeNO x processes widely used in power plants and incinerators to reduce NO x emissions [1], process control in the semiconductor industry, where extremely low levels of NH 3 in clean rooms may drastically deteriorate the performances of the lithography process [2], environment monitoring to quantify NH 3 emissions from animal production facilities and automobile traffic [3,4], or in medicine to analyse breath NH 3 levels as a diagnostic tool [5]. Whereas detection limits in the partsper-million (ppm) or sub-ppm range are sufficient for some of these applications (i.e., DeNO x process), most of them require much better performances at parts-per-billions (ppb) level.…”

Section: Introductionmentioning

confidence: 99%

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Ammonia trace measurements at ppb level based on near-IR photoacoustic spectroscopy

Besson

Schilt

Rochat³

et al. 2006

Appl. Phys. B

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A photoacoustic sensor using a laser diode emitting near 1532 nm in combination with an erbium-doped fibre amplifier has been developed for ammonia trace gas analysis at atmospheric pressure. NH 3 concentration measurements down to 6 ppb and a noise-equivalent detection limit below 3 ppb in dry air are demonstrated. Two wavelength-modulation schemes with 1 f and 2 f detection using a lock-in amplifier were investigated and compared to maximise the signal-to-noise ratio. A quantitative analysis of CO 2 and H 2 O interference with NH 3 is presented. Typical concentrations present in ambient air of 400 ppm CO 2 and 1.15% H 2 O (50% relative humidity at 20 • C) result in a NH 3 equivalent concentration of 36 ppb and 100 ppb, respectively.PACS 42.62.Fi; 43.35.Ud; 42.55.Px

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<title>Airborne chemical contamination of a chemically amplified resist</title>

Cited by 100 publications

References 0 publications

Chemical amplification & dissolution inhibition: a novel high performance positive tone deep UV resist.

Chemical amplification & dissolution inhibition: a novel high performance positive tone deep UV resist.

Further Advances in Chemistry and Technology of Acid-Hardened Resists.

Ammonia trace measurements at ppb level based on near-IR photoacoustic spectroscopy

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