2015
DOI: 10.1364/prj.3.000b28
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Lowering the energy consumption in silicon photonic devices and systems [Invited]

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Cited by 53 publications
(36 citation statements)
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“…[17][18][19][20][21] However, in the UV region, silicon photodetectors face the major challenge of low photo-responsivity (typically, less than 0.1 A W −1 for λ < 400 nm) due to high reflection coefficient and shallow penetration depth of UV light in silicon. For example, a typical silicon PN junction depth (X J ) is larger than 200 nm.…”
Section: Introductionmentioning
confidence: 99%
“…[17][18][19][20][21] However, in the UV region, silicon photodetectors face the major challenge of low photo-responsivity (typically, less than 0.1 A W −1 for λ < 400 nm) due to high reflection coefficient and shallow penetration depth of UV light in silicon. For example, a typical silicon PN junction depth (X J ) is larger than 200 nm.…”
Section: Introductionmentioning
confidence: 99%
“…The ring, waveguide and MEMS actuators can be patterned with standard optical lithography, thus rendering the fabrication of the whole system technologically feasible. Although the strong thermo-optic effect of materials used as a platform for constructing the considered filters allows one to efficiently tune them, it is also responsible for making them prone to temperature fluctuations [83]. This susceptibility may cause the bias point of the ODI and the resonance wavelength of the MRR to drift, which in turn could affect the process of suppressing the red-shifted spectral components without significantly impairing the input data carrier and eventually leading to temperature-dependent performance degradation.…”
Section: Odi Vs Mrr Qualitative Comparisonmentioning
confidence: 99%
“…Although it was numerically verified above that the MRR is, by its principle of operation, more tolerant to detuning offsets than the ODI, still, special care must additionally be taken in order to enhance the resilience of both schemes to possible temperature changes while at the same time achieving this goal in an energy-efficient manner. To this aim, it has been identified [83] that while athermal operation of the ODI is possible without any extra energy consumption, there is no efficient passive solution to the problem for the MRR, as well. Furthermore, the exploitation of negative thermo-optic materials that could resolve the thermo-optic issue in a straightforward manner faces challenges with regard to compatibility with standard CMOS technology and is the subject of intense research.…”
Section: Odi Vs Mrr Qualitative Comparisonmentioning
confidence: 99%
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“…Furthermore, they support higher bandwidth, denser interconnects, with higher efficiency in addition to reduced cross talk, latency, and specifically power consumption [3,4]. In particular, the silicon photonics platform is becoming the preferred technology for photonic integrated circuits [5,6], due to its high index contrast, low optical loss in the major telecommunications optical windows, and established CMOS fabrication technology. However, silicon's large thermo-optic coefficient (1.8 × 10 −4 /℃), can limit the application of these devices in applications where large temperature changes are experienced.…”
Section: Introductionmentioning
confidence: 99%