This paper reports that abrupt InGaAsfinP MQW interfaces are realized over 2-inch wafer by employing tertiarybutylarsine (TBA) and tertiarybutylphosphine (TBP) in place of ASH, and PH,, owing to elimination of the arsenic contanunation into the InP layer after InGaAs growth and suppression of the As-P exchange reaction at the interfaces.