Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs

Thermal Characterization of Individual Pixels in Microbolometer Image Sensors by Thermoreflectance Microscopy

“…With this direct measurement method, we determined that the temperature increment with design2 was 1.8 times higher than that of design1; this means that design2 has better thermal isolation properties than design1. In the case of uncooled microbolometer detectors, vacuum packaging is critical to maximize the thermal isolation, and ensure good responsivity [13]. In this work, we measured the thermal distribution images under various pressures to investigate the dependence of the thermal isolation properties on pressure.…”

Wafer-level hermetic vacuum micro-packaging technology for IR detector applications

“…less than 10 mTorr for 10 years, requires the equivalent flow rate of the 57 MG2 14.00 -14.15 978-1-4244-3681-1/09/$25.00 ©2009 IEEE package to be smaller than 2x10 -15 Torr.L/sec at the maximum operating temperature of the package. In order to measure such small variation of the pressure inside the package, integrated micromachined pressure gauges were packaged inside the micropackages [4,5]. With the current method used to interrogate the pressure gauges, an error of less than 3 mTorr for pressures under 100 mTorr is typically achieved.…”

“…INO micropackaging technology has already been described elsewhere [5]. Basically, three wafers are microfabricated.…”

High vacuum wafer level packaging for high-value MEMS applications

“…In the past years, results with vacuum close to 10 -3 mbar have already been published with Chip Scale Packaging (CSP) technologies, for µbolometers application as an example [2]. But, to the best of our knowledge, very little works have been published about such high vacuum level obtained with Wafer Level Packaging (WLP) technologies.…”