“…[19][20][21] So far, many III-nitride films have been grown on metal substrates using traditional PLD, [2][3][4][22][23][24] and the combination of electron cyclotron resonance plasma enhanced metal-organic chemical vapor deposition (ECR-PEMOCVD) and radio-frequency magnetron sputtering. [25][26][27][28] Particularly, GaN films grown on Cu substrates using the traditional PLD technology have been demonstrated by S. Inoue et al 4 However, GaN films grown by these techniques usually show a relatively poor thickness homogeneity due to the highly directional distribution of the precursors on the metal substrates. [2][3][4][22][23][24][25][26][27][28] If the GaN-based optoelectronic devices were prepared with such GaN films, the product qualification rate would be very low.…”