Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics

Zhong, Ying; An, Rong; Ma, Haile; Wang, Chunqing

doi:10.1016/j.actamat.2018.09.069

Cited by 33 publications

(14 citation statements)

References 43 publications

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“…Flexible and wearable devices have become a forefront topic in the research and development of the electronic industry. However, integration of functional components such as semiconductors and inorganic chips remains a barrier in achieving the robustness of the flexible electronic device (FET) (Ref 1 ). Presently, conductive adhesives are utilized as an interconnect material for flexible electronics.…”

Section: Introductionmentioning

confidence: 99%

“…Presently, conductive adhesives are utilized as an interconnect material for flexible electronics. Conductive adhesives have poor electrical conductivity and impact strength at high operating temperatures (Ref 1 , 2 ). Research toward establishing solder materials for high power FET’s are highly focused, in particular, eutectic Sn-Bi solders capture the growing interest due to their cost effectiveness and melting temperature (139 °C) (Ref 2 - 7 ).…”

Section: Introductionmentioning

confidence: 99%

“…Research toward establishing solder materials for high power FET’s are highly focused, in particular, eutectic Sn-Bi solders capture the growing interest due to their cost effectiveness and melting temperature (139 °C) (Ref 2 - 7 ). Meanwhile, brittleness of Bi phase inter-metallic compounds (IMC) accounts to a reliability concern since FET’s may experience mechanical shock upon bending (Ref 1 ). Addition of NPs in Sn-Bi solder alloy is an efficient way to improve the reliability of the solder joints by reducing the IMC thickness as well as refining the brittle Bi phase (Ref 3 ).…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Rajendran

Kang

Jung

2021

J. of Materi Eng and Perform

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Nanocomposite Sn-Bi solders received noticeable attention for flexible electronics due to their improved mechanical properties. The main limitation is the dispersion of nanoparticles in the solder alloy. Accordingly, in this work, varying additions of ZnO nanoparticles were successfully dispersed into Sn57Bi solder via the liquid-state ultrasonic treatment. Nanocomposite solders were prepared using the melting and casting route. The solder alloys were then characterized for microstructure, spreading and mechanical properties. With increasing ZnO addition, the microstructure revealed significant refinement of Bi-and Snrich phases. Consequently, the eutectic lamellar spacing also decreases. The spreading improved up to 0.1 wt.% ZnO addition. For higher additions, nanocomposite solders experienced deterioration in spreading characteristics. The tensile strength of the solder increases with an increase in the amount of ZnO nanoparticles. High ductility is achieved for nanocomposite solder containing 0.05 wt.% ZnO. An attempt was made, to explain the effect of increasing ZnO nanoparticle addition on microstructural, spreading, and mechanical properties of Sn57Bi solder.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Rajendran

Kang

Jung

2021

J. of Materi Eng and Perform

View full text Add to dashboard Cite

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“…An alternative way to improve the strength of a joint is adding micro-or nano-sized ceramic particles [6,7] or carbon nanotubes [8] into a Sn-based solder. Generally, the strength of these Sn-based solders can be substantially improved by dispersing strengthening [9]. However, the added second phases tend to aggregate during the soldering process, and cracks and cavities are easily created in the solder seam because of the poor interfacial bonding between Sn-based solder and the strengthening phases.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Huang

et al. 2020

Journal of Alloys and Compounds

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In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based composite solders at 260 °C for different times. The tensile strength of pure Sn solder was improved significantly by the addition of metal foams, and the Cu-Ni alloy/Sn composite solder exhibited the highest tensile strength of 50.32 MPa. The skeleton networks of the foams were gradually dissolved into the soldering seam with increasing soldering time, accompanied by the massive formation of (Cu,Ni) 6 Sn 5 phase in the joint. The dissolution rates of Ni foam, Cu coated Ni foam and Cu-Ni alloy foams into the Sn matrix increased successively during soldering. An increased dissolution rate of the metal foam leads to an increase in the Ni content in the soldering seam, which was found to be beneficial in refining the (Cu,Ni) 6 Sn 5 phase and inhibiting the formation of the Cu 3 Sn IMC layer on the Cu substrate surface. The average shear strength of the Cu joints was improved with increasing soldering time, and a shear strength of 2 61.2 MPa was obtained for Cu joints soldered with Cu-Ni alloy/Sn composite solder for 60 min.

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“…Metal-metal bonding is an indispensable process especially in fields such as electronics and metal processing [1][2][3][4]. Conventional metal-metal bonding is performed by annealing two or more metallic materials at high temperatures [5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Preparation of high-concentration colloid solutions of metallic copper particles and their use in metal–metal bonding processes

et al. 2019

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A high-concentration colloid solution of metallic copper nanoparticles was prepared by the reduction of copper ions in aqueous solutions, and the nanoparticles were used to study metal-metal bonding. The colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of CuCl 2 and an aqueous solution of hydrazine (reductant) in the presence of citric acid and n-hexadecyltrimethylammonium bromide (stabilizers) at a final copper concentration as high as 0.1 M. The copper-particle size was ca. submicrometer. Many tiny particles with sizes of ca. 10-20 nm were deposited on the submicron-sized particles at high hydrazine concentrations. The tiny particles were considered to be produced through the growth of particle nuclei generated at the final reaction stage by residual hydrazine derived from the high hydrazine concentration. Metallic-copper discs were successfully bonded by annealing at 400 °C and a pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metallic-copper particles. The shear strength of the bonded copper discs was then measured. The highest shear strength of 41.7 MPa was recorded for the tiny particles/ immobilized particles, which could be explained by the low melting points of the tiny particles and the increase in bulk density provided by the dominant incorporation of the tiny particles into voids between the submicron-sized particles.

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Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics

Cited by 33 publications

References 43 publications

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Preparation of high-concentration colloid solutions of metallic copper particles and their use in metal–metal bonding processes

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