Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Abstract

Traditional materials used in chip-level interconnections are not compatible with the high-temperature operation of wide-bandgap high-power semiconductor devices; therefore, this paper studies sintered nano-silver as a novel interconnect material mounting semiconductor devices onto metallized substrates. A low-temperature sintering process was employed in the preparation of a sintered nano-silver die-attachment. The physical mechanisms in volatilization and burnout of the added organic components employed in nanosilver paste were analyzed primarily by thermal gravimetric analysis (TGA) to obtain a reasonable temperature-controlling profile. The shear strength of sintered nano-silver joints was investigated, and the evolution of microstructure in the nano-silver paste sintering process was observed using a scanning electron microscope (SEM) in this process. The effects of sintering temperature, heating rate, and holding time during the sintering process were analyzed according to the densification mechanism. The microstructural observations and shear strength tests showed that a sintering temperature of 285°C, heating rate of 10°C/min, and holding time of 60 min were the best conditions for using this kind of silver paste.

Die attach using silver sintering. Practical implementation and analysis

“…Several process parameters were varied, as described in table 1: thickness of the paste deposit, type of substrate, sintering pressure. The other parameters (mainly the temperature profile) were directly taken from a publication from CPES (Wang et al, 2007).…”

“…The temperature profile was chosen according to the literature (Wang et al, 2007). It is depicted in Figure 5.…”

Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization

“…Several articles have focused on the bonding process using this paste. The main parameters being studied were the temperature profile [11] (number and temperatures of the steps, ramping time. .…”

Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature

“…Therefore, the introducing of environmental friendly die-attaching material becomes more and more important due to increasing stringent requirements of weight reduction, size miniaturization, high thermal dissipation, etc. [2].…”