Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature.In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process. Keywords« Die attach », « silver sintering », « Shear test », « high temperature packaging ».
ABSTRACT. Silver sintering is a promising alternative to high melting point (HMP) solders which contain lead. Indeed, it offers better thermal and electrical properties, and can operate at higher temperature. Currently, several implementations of this technique are available, based on various silver particles sizes and sintering additives. This paper presents a review of the different implementations, and gives practical details about one of them, based on silver nanoparticles. One specific aspect is highlighted: the metal finish of the DBC substrate. It has a major impact on the quality of the sintered joint: with some finishes, the adhesion is excellent (more than 50 MPa), while it is poor with some others (lower than 10 MPa).RÉSUMÉ. Le frittage d'argent est un candidat prometteur pour remplacer les brasures haute température au plomb. Il offre en effet de meilleures performances thermiques, électriques et fonctionne à plus haute température. Actuellement, plusieurs solutions existent, basées sur des particules d'argent de tailles différentes et l'ajout d'additifs de frittage. Ces solutions diffèrent par leur procédé de mise en oeuvre. Cet article présente un état de l'art des différentes techniques, puis détaille la mise en oeuvre de l'une d'entre elles, basée sur des nanoparticules. Un point particulier est mis en évidence: la finition métallique des substrats DBC. Cette finition a un effet majeur sur la qualité du joint fritté: dans certains cas, l'attache est excellente (tenue mécanique supérieure à 50 MPa), alors que dans d'autres, elle est inférieure à 10 MPa.KEYWORDS: power electronics packaging, silver sintering, high temperature.MOTS-CLÉS : packaging en électronique de puissance, frittage d'argent, haute température.
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