Low Temperature Sintering Cu<sub>6</sub>Sn<sub>5</sub> Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections

Zhong, Ying; An, Rong; Wang, Chunqing; Zheng, Zhen; Liu, Zhiquan; Liu, Chin‐Hung; Li, Caifu; Kim, Tae Kyoung; Jin, Sung‐Ho

doi:10.1002/smll.201500896

Cited by 52 publications

(20 citation statements)

References 34 publications

(22 reference statements)

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“…Cu 6 Sn 5 is a useful engineering material with a bulk melting temperature of 415 o C, and with several key applications for electronic devices [17], chemical catalyst [18], and lithium batteries [19]. In our previous publications [20,21], pore-free Cu 6 Sn 5 nanocrystalline joints were prepared and utilized as a circuit interconnection material with creep-resistant characteristics, operable at temperatures (e.g. 300 ∼ 350 o C) even higher than the soldering temperatures (e.g.…”

Section: Introductionmentioning

confidence: 99%

“…The nanograined Cu 6 Sn 5 possesses a much lower Young's Modulus than the bulk Cu 6 Sn 5 . However, based on in-situ TEM heating part observations, the grains were seen to coarsen to tens of nanometers [20], which should not lead to such a large reduction in Young's Modulus [21]. Therefore, a further in-depth microstructural evolution of Cu 6 Sn 5 NPs was analyzed even during the cooling period to find out what is happening upon cooling at the atomic level to understand the mechanism better.…”

Section: Introductionmentioning

confidence: 99%

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Spontaneous formation of sub-4 nm nanocrystalline alloy via polymorphic phase transformation

Zhong

Wang

et al. 2020

Materials Research Letters

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A new phase-transformation-induced path to spontaneous formation of extreme nanograin structure is reported. In-situ-heating-mode-microscopy exhibited a substantial grain-growth of Cu 6 Sn 5 . During cooling, the grain-growth continued, but it spontaneously switched to grain-refinement mode on phase transformation through ∼ 180°C from η-Cu 6 Sn 5 to η'-Cu 6 Sn 5 , ending up with an extremely small nanograin size of ∼ 2.5 nm. The cooling cycling always restores the nanograin size regardless of thermal exposure history, making this to be the first demonstration to stabilize the nanograin with its own spontaneous behavior. The Young's Modulus was significantly reduced by ∼ ×3, and the elongation was remarkably increased by ∼ ×8 to ∼ 9%. IMPACT STATEMENTMonitoring cooling and phase transformation at atomic level revealed a new path to manufacture and stabilize extremely refined sub-4 nm grains by taking advantage of the spontaneous phase transformation behavior.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Spontaneous formation of sub-4 nm nanocrystalline alloy via polymorphic phase transformation

Zhong

Wang

et al. 2020

Materials Research Letters

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“…solids formed from nanoparticles 35 . Under quasi-static loading, Mars-1a did not obey this trend: as the initial particle size changes from less than 20 μm to nearly 100 μm, R remains similar.…”

Section: Resultsmentioning

confidence: 99%

Direct Formation of Structural Components Using a Martian Soil Simulant

Chow

Chen

Zhong

et al. 2017

Sci Rep

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Martian habitats are ideally constructed using only locally available soils; extant attempts to process structural materials on Mars, however, generally require additives or calcination. In this work we demonstrate that Martian soil simulant Mars-1a can be directly compressed at ambient into a strong solid without additives, highlighting a possible aspect of complete Martian in-situ resource utilization. Flexural strength of the compact is not only determined by the compaction pressure but also significantly influenced by the lateral boundary condition of processing loading. The compression loading can be applied either quasi-statically or through impact. Nanoparticulate iron oxide (npOx), commonly detected in Martian regolith, is identified as the bonding agent. Gas permeability of compacted samples was measured to be on the order of 10−16 m2, close to that of solid rocks. The compaction procedure is adaptive to additive manufacturing.

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“…The enhancement of a solder's properties through compositional modification or according to the incorporation of a specific additive is an antinomic task because although significant properties of a solder such as electrical conductivity, thermal behavior, and mechanical strength can be improved through alloying an element, such improvements can demand the sacrifice of other important properties of the same solder . For example, although the addition of the small amount (3.8 wt%) of Ag into Sn can decrease the melting point of the solder alloy from 231.9 to 221.7 °C, the stress and strain caused by the formation of intermetallic Sn–Ag compound (IMC) become the main driving force with regard to whisker growth .…”

Section: Introductionmentioning

confidence: 99%

A Modular Solder System with Hierarchical Morphology and Backward Compatibility

Lee

Kim

et al. 2018

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A modular solder system with hierarchical morphology and micro/nanofeatures in which solder nanoparticles are distributed on the surface of template micropowders is reported. A core-shell structure of subsidiary nanostructures, which improved the intended properties of the modular solder is also presented. In addition, polymer additives can be used not only as an adhesive (like epoxy resin) but also to impart other functions. By combining all of these, it is determined that the modular solder system is able to increase reflowability on a heat-sensitive plastic substrate, oxidation resistance, and electrical conductivity. In this respect, the system could be readily modified by changing the structure and composition of each constituent and adopting backward compatibility with which the knowledge and information attained from a previously designed solder can offer feedback toward further improving the properties of a newly designed one. In practice, In-Sn-Bi nanoparticles engineered on the surface of Sn-Zn micropowders result in pronounced reflowing on a flexible Au-coated polyethylene terephthalate (PET) substrate even at the low temperature of 110 °C. Depending on their respective concentrations, the incorporation of CuO@CeO nanostructures and poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) polymers increases oxidation resistance and electrical conductivity of the modular solder.

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Low Temperature Sintering Cu₆Sn₅ Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections

Cited by 52 publications

References 34 publications

Spontaneous formation of sub-4 nm nanocrystalline alloy via polymorphic phase transformation

Spontaneous formation of sub-4 nm nanocrystalline alloy via polymorphic phase transformation

Direct Formation of Structural Components Using a Martian Soil Simulant

A Modular Solder System with Hierarchical Morphology and Backward Compatibility

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Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections

Cited by 52 publications

References 34 publications

Spontaneous formation of sub-4 nm nanocrystalline alloy via polymorphic phase transformation

Spontaneous formation of sub-4 nm nanocrystalline alloy via polymorphic phase transformation

Direct Formation of Structural Components Using a Martian Soil Simulant

A Modular Solder System with Hierarchical Morphology and Backward Compatibility

Contact Info

Product

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Low Temperature Sintering Cu₆Sn₅ Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections