2010
DOI: 10.1111/j.1551-2916.2010.03866.x
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Low‐Temperature Sintering and Electrical Properties of ZnO–Bi2O3–TiO2–Co2O3–MnCO3‐Based Varistor with Bi2O3–B2O3 Frit for Multilayer Chip Varistor Applications

Abstract: The effects of a Bi2O3–B2O3 frit (denoted as BiBF) on the densification, phase transformation, microstructure, and nonlinear electrical properties of ZnO–Bi2O3–TiO2–Co2O3–MnCO3 (ZBTCM)‐based varistors have been investigated. The varistor ceramic with the addition of >2 wt% BiBF can be sintered at 900°C and 96.3% of the theoretical density was achieved. SEM revealed that the microstructure of the varistor ceramics with 2 wt% BiBF is uniform, with an average grain size of 13.5 μm. No porosity is observed. The ty… Show more

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Cited by 56 publications
(21 citation statements)
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“…Thus, it is urgent to develop the high-voltage ZnO-Bi 2 O 3 -based varistors materials with a low sintering temperature. Wan et al [14,15] reported that adding Bi 2 O 3 -B 2 O 3 frit or Zn-B glass could reduce the sintering temperature of ZnO varistors to 900°C. B 2 O 3 has low melting temperature (450°C) and could form stable glasses in a wide compositional range when substituted for boron in borate based glasses [16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…Thus, it is urgent to develop the high-voltage ZnO-Bi 2 O 3 -based varistors materials with a low sintering temperature. Wan et al [14,15] reported that adding Bi 2 O 3 -B 2 O 3 frit or Zn-B glass could reduce the sintering temperature of ZnO varistors to 900°C. B 2 O 3 has low melting temperature (450°C) and could form stable glasses in a wide compositional range when substituted for boron in borate based glasses [16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…There are several types of practical varistor ceramic systems studied such as ZnO [1], SnO 2 [2], WO 3 [3], SrTiO 3 [4], TiO 2 [5]. ZnO-based varistors with high nonlinear coefficients are the most widely used in electronic circuits and devices [6].…”
Section: Introductionmentioning
confidence: 99%
“…The state-of-the-art technology enables to fabricate a multilayer structure with an interelectrode spacing of around 1 m [5], and the commercialization of multilayer ceramic chip capacitors, with the smallest size of 2012 (2.0 mm× 1.25 mm), with extremely large capacitance values of >22 F has recently been realized by Murata Co. Similar fabrication techniques for multilayer tip-type devices have been applied to other electronic ceramics, including thermistors [6], varistors [7], and inductors [8], resulting in a considerable success in the improvement of the performance of their devices. However, since the current powder processing-based ceramic technology has substantial technical limitations that hardly allow creating two-and threedimensional ceramic nanostructures with feature sizes of <100 nm, it is essential to develop innovative nanocrystal-based ceramic technology comparable with the photolithography-based semiconductor (or silicon) technology to open a new horizon in the field of electronic ceramics.…”
Section: Introductionmentioning
confidence: 99%