Low temperature sintering and characteristics of K2O–B2O3–SiO2–Al2O3 glass/ceramic composites for LTCC applications

Abstract

The K glasses with different Al 2 O 3 content were prepared. Different proportions (50, 55, 60, 65, 70 %) of the three glasses were respectively mixed with alumina ceramic-filler, then the mechanical and dielectric properties were investigated. The results showed K 2 O-B 2 O 3 -SiO 2 -2 %Al 2 O 3 glass/alumina filler (glass:alumina = 60:40) had the excellent comprehensive properties, so further study was continued with part of alumina ceramic-filler replaced by the silica ceramicfiller on this composite. Then the X-ray diffraction analysis revealed that the alumina and silica fillers existed as the crystal phase, and the densification was seriously damaged when the silica content reached to three quarters of the fillers. With the increase of the silica-filler, the composites' density and dielectric constant exhibited uniform decrease, but thermal expansion coefficient (TEC) uniformly increased. When the glass:alumina:silica was equal to 60:30:10, a best composite property was presented as a bulk density of 2.582 (g cm -1 ), a dielectric constant of 6.1 and a dielectric loss of 2 9 10 -3 at 1 MHz, a flexural strength of 168 MPa, and a TEC of 8.62 9 10 -6°C-1 .

Low κ, low loss alumina-glass composite with low CTE for LTCC microelectronic applications

“…According to the literature reports, silica rich glasses usually have low dielectric constant because of the low dielectric constant of silica [26]. The dielectric properties of the composite are influenced by densification and the constituent phases in the composite [29]. The effect of the increased silica content as well as the influence of secondary phases may be the reason for the low dielectric constant of the composite.…”

The tape casting process for manufacturing low‐temperature co‐fired ceramic green sheets: A review

“…The sintering temperature is designed to be below 1000°C, which makes it possible to use low‐resistivity conductors, such as silver and gold. The high conductivity enables rapid signal transmission between modules while minimizing energy loss …”

“…The high conductivity enables rapid signal transmission between modules while minimizing energy loss. [5][6][7][8][9] Low-temperature co-fired ceramic materials are often used as substrates for packages, for example, in dual-band baluns, bandpass filters, power distribution networks, point-to-point transceivers (passive elements) and voltage-controlled oscillators, dielectric resonator oscillators, amplifiers, and singly balanced mixers (active components). Figure 1A shows point-to-point transceivers.…”

Synthesis and characteristics of borosilicate-based glass–ceramics with different SiO2 and Na2O contents

“…It was demonstrated that the addition of Al 2 O 3 and K 2 O to Li 2 OeSiO 2 system resulted in improving densification and mechanical strength of the composites by Hugo R. Fernandes et al [10]. Qin Xia et al [11] reported that in the K 2 OeB 2 O 3 eSiO 2 glass/alumina composites, the addition of Al 2 O 3 in the glass system could inhibit the cristobalite formation, improve the microwave properties and increase the flexural strength as the formation of strong [AlO 4 ]. However, few studies systematically investigated the general function of glass network former (SiO 2 ) and the glass network amender (Na 2 O) on the glasseceramics composites.…”