2006
DOI: 10.1051/epjap:2006042
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Low temperature semi-quantitative analysis of local electrical field in silicon diode by transmission electron microscopy

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(4 citation statements)
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“…In contrast, for PCMO–STNO we obtain FWHM ≈ 50 nm which corresponds to the width of profiles taken at thicknesses just above tth(PS)80nm. A slight increase of the acceleration voltage to e.g. 15 kV and a smaller beam diameter reduce the FWHM to 10 nm for PCMO, which matches the resolution obtained in STEBIC experiments at 200 kV .…”
Section: Resultssupporting
confidence: 75%
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“…In contrast, for PCMO–STNO we obtain FWHM ≈ 50 nm which corresponds to the width of profiles taken at thicknesses just above tth(PS)80nm. A slight increase of the acceleration voltage to e.g. 15 kV and a smaller beam diameter reduce the FWHM to 10 nm for PCMO, which matches the resolution obtained in STEBIC experiments at 200 kV .…”
Section: Resultssupporting
confidence: 75%
“…3(b) at different thicknesses indicated in the legend). This behaviour is expected from our simulations as the integral of the generation volume decreases with decreasing lamella thickness and is consistent with results obtained at 200 kV STEBIC experiments [6]. Data obtained for the Si p-n junction show a qualitatively similar EBIC signal decrease with decreasing thickness (compare Fig.…”
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confidence: 92%
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