2009
DOI: 10.1149/1.3008009
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Low-Temperature, Low-Pressure Chemical Vapor Deposition and Solid Phase Crystallization of Silicon–Germanium Films

Abstract: Low-pressure chemical vapor deposition of silicon-germanium ͑Si 1−x Ge x ͒ and its SPC below 400°C are investigated. The effects of precursor ratio ͓SiH 4 /SiH 2 Cl 2 ͑DCS͒:GeH 4 ͔, pressure, and temperature are examined with the goals of film composition tunability and high deposition rates. SiH 4 is found to be a better source gas than DCS because the decomposition rate of SiH 4 is faster than that of DCS during the deposition process. In the SiH 4 :GeH 4 system, the binary deposition mechanism is well expla… Show more

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Cited by 34 publications
(30 citation statements)
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“…These values are the highest among the low temperature synthesized SGOIs. [16][17][18][19][36][37][38][39][40][41] The electrical properties of the Si 1-x Ge x layers were evaluated using Hall measurements with the Van der Pauw method. The sample of each composition was formed at three annealing temperatures.…”
Section: -2mentioning
confidence: 99%
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“…These values are the highest among the low temperature synthesized SGOIs. [16][17][18][19][36][37][38][39][40][41] The electrical properties of the Si 1-x Ge x layers were evaluated using Hall measurements with the Van der Pauw method. The sample of each composition was formed at three annealing temperatures.…”
Section: -2mentioning
confidence: 99%
“…[13][14][15] For incorporating SGOI structures in inexpensive glass substrates or three-dimensional large-scale integrated circuits (LSIs), the entire process from crystallization to device fabrication, including impurity doping, must be done at low temperature (<500 C) to avoid damage. [16][17][18][19] Metal-induced layer exchange (MILE) was developed for elemental Si [20][21][22][23][24][25][26][27][28][29] and Ge, [30][31][32][33][34][35] which allowed for large-grained, orientationcontrolled layers on insulators at low temperature. For optoelectronic device applications, the MILE using Al has been actively investigated for fabricating highly doped p-type layers, also working as seed layers for light absorption layers.…”
Section: Introductionmentioning
confidence: 99%
“…For incorporating SGOI structures in inexpensive glass substrates or three-dimensional large-scale integrated circuits, low temperature process (< 500 °C) is required. In line with this, many growth techniques have been developed: chemical-vapor deposition [14][15][16][17], sputtering [18], laser annealing [19], and metal-induced crystallization (MIC) [20][21][22]. Among them, MIC is especially useful to lower the crystallization temperature of amorphous (a-) SiGe.…”
mentioning
confidence: 99%
“…Many researchers have developed the advanced growth techniques: metal-induced solid-phase crystallization (SPC), laser annealing, and chemical-vapor deposition (CVD). [7][8][9] However, the grown Ge layers consisted of small grains (<lm) with almost random orientations.…”
mentioning
confidence: 99%