2018
DOI: 10.1063/1.5022088
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Low-temperature fabrication of sputtered high-k HfO2 gate dielectric for flexible a-IGZO thin film transistors

Abstract: In this work, low temperature fabrication of a sputtered high-k HfO2 gate dielectric for flexible a-IGZO thin film transistors (TFTs) on polyimide substrates was investigated. The effects of Ar-pressure during the sputtering process and then especially the post-annealing treatments at low temperature (≤200 °C) for HfO2 on reducing the density of defects in the bulk and on the surface were systematically studied. X-ray reflectivity, UV-vis and X-ray photoelectron spectroscopy, and micro-wave photoconductivity d… Show more

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Cited by 89 publications
(38 citation statements)
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“…Microwave photoconductivity decay (µ-PCD) is a noncontact and nondestructive technology with low cost and short time [33][34][35]. Information regarding the defect state density can be obtained by the microwave reflectivity of the photo-carrier trapping and recombination, this being an important parameter for the evaluation of the quality of the semiconductor thin films.…”
Section: Introductionmentioning
confidence: 99%
“…Microwave photoconductivity decay (µ-PCD) is a noncontact and nondestructive technology with low cost and short time [33][34][35]. Information regarding the defect state density can be obtained by the microwave reflectivity of the photo-carrier trapping and recombination, this being an important parameter for the evaluation of the quality of the semiconductor thin films.…”
Section: Introductionmentioning
confidence: 99%
“…Because the active layer and the insulating layer were prepared in the same process for all samples during the experiment. Therefore, the reason for the decrease in the subthreshold swing may be the reduction of bulk defects in the active layer [32]. This bulk defects are mainly oxygen vacancies.…”
Section: Resultsmentioning
confidence: 99%
“…Vacuum-processes. Research trends (Table 1) for vacuum-processed oxide TFTs are as follows: (1) variation in oxide semiconductor materials and use of high-k dielectrics to achieve high µ [6][7][8][9][10][11][12][13]; (2) low-cost and non-toxic implementation using indium-free compositions [14][15][16]; (3) high-reliability components based on flexible substrates [17]; and (4) vacuum-deposition technology that uses non-sputtering methods (e.g. atomiclayer deposition (ALD) or metalorganic chemical-vapor deposition (MOCVD)) [14,16,18].…”
Section: Metal Oxide Tftsmentioning
confidence: 99%