2012
DOI: 10.1016/j.microrel.2011.07.008
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Low temperature fabrication of Ni–P metallic patterns on ITO substrates utilizing inkjet printing

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Cited by 11 publications
(5 citation statements)
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“…The substrate surface was then roughened by sand blasting with 220-grit sands. Before TCVD, Pd catalyst was deposited on the wire substrates by dipping the wires into a poly(styrene-co-NIPAAm)/Pd solution (see [26,27] for the details of preparation) and then drying at 80 ∘ C in air. Figure 1 shows a schematic of cathode preparation.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The substrate surface was then roughened by sand blasting with 220-grit sands. Before TCVD, Pd catalyst was deposited on the wire substrates by dipping the wires into a poly(styrene-co-NIPAAm)/Pd solution (see [26,27] for the details of preparation) and then drying at 80 ∘ C in air. Figure 1 shows a schematic of cathode preparation.…”
Section: Methodsmentioning
confidence: 99%
“…In this study, we grew CNTs and CNCs separately on 304 stainless steel (304-SS) wires utilizing a poly(styrene-co-NIPAAm)/Pd catalyst (reported in our previous study [26,27]) as the FEL cathode and compare their FE characteristics. Higher lighting uniformity and light-spot density at lower current density, as well as greater luminescence efficiency and a longer anode phosphor life, were observed in the FEL with a CNC cathode.…”
Section: Introductionmentioning
confidence: 99%
“…It includes simultaneous printing of water-soluble metal salt and reducing agent leading to in situ formation of the metal. The patterning of conductive circuit on paper was previously reported using a dielectric material and silver nitrate solution to reduce the salt to metal (Liu et al, 2012). Similarly, recent research shows the capability of inkjet printing for circuit integration using electroless metal deposition on flexible surface.…”
Section: Introductionmentioning
confidence: 92%
“…In another attempt, the palladium (Pd) catalyst layer was electroless plated on substrate for deposition of other metals by employing inkjet printing. Liu et al (2012) used Pd ink and Ni-phosphorus (P) electroless plating for metalizing patterns on indium tin oxide glass substrates. In another study, water-based ink, containing polyvinyl acetate (PVAc/Pd) nanoparticles was utilized to improve adhesion between Pd nanoparticles and substrate (Tseng et al, 2011).…”
Section: Introductionmentioning
confidence: 99%
“…In our previous studies [36,37], a styrene-N-isopropylacrylamide (St-co-NIPAAm) oligomer with sulfate group on chain end synthesized by free-radical polymerization was used to reduce and stabilize the Pd nanoparticles without any surfactant. Owing to the thermoresponsive characteristic of N-isopropylacrylamide, the Pd nanoparticle that was reduced and stabilized by St-co-NIPAAm oligomer showed good dispersion and excellent stability in the aqueous solution and can be used as an ink for inkjet printing.…”
Section: Introductionmentioning
confidence: 99%