2004
DOI: 10.1016/j.matlet.2004.03.018
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Low temperature deposition of crystalline AlN films by bias-enhanced Cat-CVD

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Cited by 4 publications
(3 citation statements)
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“…The aluminum nitride is one of the effective protection films with high hardness and high thermal conductivity. [1,2] The aluminum nitride film has been produced by using various processing techniques such as plasma nitriding, [3] CVD, [4] PVD, [5] spray coating, [6] and gas nitriding, [7] and these studies have already been reported by many researchers. In the conventional process, the nitriding of the aluminum surface is very difficult because of the thin aluminum oxide layer existing on the surface.…”
Section: Introductionmentioning
confidence: 99%
“…The aluminum nitride is one of the effective protection films with high hardness and high thermal conductivity. [1,2] The aluminum nitride film has been produced by using various processing techniques such as plasma nitriding, [3] CVD, [4] PVD, [5] spray coating, [6] and gas nitriding, [7] and these studies have already been reported by many researchers. In the conventional process, the nitriding of the aluminum surface is very difficult because of the thin aluminum oxide layer existing on the surface.…”
Section: Introductionmentioning
confidence: 99%
“…[1] So far, deposition, ion implantation, and plasma techniques have been used to form the aluminum nitride films on aluminum substrates. [2][3][4] However, these processes have a problem in terms of the delamination of the film caused by thermal stress, that is, thermal stress cracking. Delamination of the film is affected by the mechanical properties of the modified layer and substrate, [5] and the mechanical properties of film strongly depend on the coating method.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, aluminum and aluminum alloys have been a focus of constant attention as alternative materials of steel 1. So far, deposition, ion implantation, and plasma techniques have been used to form the aluminum nitride films on aluminum substrates 2–4. However, these processes have a problem in terms of the delamination of the film caused by thermal stress, that is, thermal stress cracking.…”
Section: Introductionmentioning
confidence: 99%