Low-Temperature-Curing Type Positive-Tone Photosensitive Polyimide Coatings for Insulating Layer in OLED Displays.

Okuda, Ryoji; Miyoshi, Kazuto; Arai, Nana; Tomikawa, Masao; Ohbayashi, Gentaro

doi:10.2494/photopolymer.15.205

Cited by 13 publications

(3 citation statements)

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“…For these reasons, PIs are one of the most prominent candidates in the field of electronics for a flexible substrate as an insulation layer. But there are some drawbacks such as a mismatch of coefficient of thermal expansion (CTE) between layers that gives rise to strain and crack under thermal cycling during device fabrication …”

Section: Introductionmentioning

confidence: 99%

Enhanced interaction in the polyimide/sepiolite hybrid films via acid activating and polydopamine coating of sepiolite

Kim

Choi

Jeong

et al. 2018

Polymers for Advanced Techs

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We aimed at enhancing interaction in the polyimide/sepiolite hybrid films with the loading of sepiolite in the polyimide matrix ranged from 0 to 8 wt% via acid activating and polydopamine doping. First, sepiolite was treated with a 3M HCl solution under reflux conditions. Then the acid-activated sepiolite was coated by mussel-inspired polydopamine under alkaline conditions.The coated polydopamine was found to successfully enhance dispersibility of sepiolite in the polyimide matrix. The modification of the sepiolite in the hybrid films was investigated by Fourier transform infrared spectroscopy, wide-angle X-ray diffraction, field emission scanning electron microscopy, thermogravimetric analysis, and transmission electron microscope. The results indicated that polydopamine coating could increase interaction between the polyimide matrix and sepiolite. KEYWORDS acid activation, polydopamine, polymer/clay nanocomposite, pyromellitic dianhydride-4,4′oxydianiline polyimide, sepiolite

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Section: Introductionmentioning

confidence: 99%

Enhanced interaction in the polyimide/sepiolite hybrid films via acid activating and polydopamine coating of sepiolite

Kim

Choi

Jeong

et al. 2018

Polymers for Advanced Techs

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“…[7,8] Satisfactory electrical properties, e.g., low leakage current density, low dielectric constant (e), and dielectric loss (tand), are crucial to the sealing resins for direct encapsulation in order to enhance the device performance and reduce the power consumption. However, it is well known that the UV curing conditions affect the physical properties of encapsulation resins.…”

Section: Full Papermentioning

confidence: 99%

Effect of UV Curing on Electrical Properties of a UV‐Curable co‐Polyacrylate/Silica Nanocomposite as a Transparent Encapsulation Resin for Device Packaging

Wang

Hsieh

2007

Macro Chemistry & Physics

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Electrical properties of UV‐curable co‐polyacrylate/silica nanocomposite resins prepared via sol‐gel process for device encapsulation were investigated. It was found that, by appropriate UV curing process and the formation of nanoscale silica particles finely dispersed in the resin matrix, the leakage current density of the nanocomposite resin films decreases from 235 to 1.3 nA · cm−2 at the applied electrical field of 10 kV · cm−1. The silica nanoparticles also restricted the motions of polar functional groups in organic matrix that the nanocomposite films with satisfactory dielectric properties [dielectric constant (ε) = 3.93 and tangent loss (tanδ = 0.0472) could be obtained. Chemical structure analyses revealed that excessive UV curing results in photooxidation and/or photodegradation in resin samples, leading to the polar groups and ionic/radical segments in organic matrix as well as the SiOSi structure in the vicinity of silica nanoparticles. These organic/inorganic functional groups generated more permeation paths for charge carrier migration and hence deteriorated the electrical properties of the nanocomposite samples. Though post‐baking treatment at 80 °C for 1 h followed by UV curing improved the rigidity of the resin sample, it brought the polar functional groups closer to each other and similarly degraded electrical properties of the nanocomposite resins.magnified image

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“…However, these acrylic and phenolic resins have poor heat resistance and are subject to yellowing owing to oxidative deterioration upon curing at 230 °C. A positive photosensitive coating using a heatresistant polyimide resin is also known, [6][7][8] but the resin itself is colored and its transparency is not sufficient for practical use. Therefore, there is an urgent need for the development of a new positive photosensitive coating having colorless transparency as well as heat and chemical resistance in the visible-light region, which is difficult with current organic materials.…”

Section: Introductionmentioning

confidence: 99%

Intermolecular interactions between sol–gel-derived random-structure oligomeric silsesquioxanes and a diazonaphthoquinone derivative

Suwa¹,

Kamogawa²,

Fujii³

et al. 2021

Jpn. J. Appl. Phys.

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Oligomeric silsesquioxanes (Oligo-SQs) with random structures featuring phenyl (Ph) groups or both Ph and methyl (Me) groups as their substituents were synthesized by the sol–gel method. The ratio of Ph and Me groups controlled the molecular weights and branching in the Oligo-SQs. Branching increased as the molecular weight increased (when the alkaline dissolution rates of all Oligo-SQs adjusted to ∼40 nm s−1). A diazonaphthoquinone (DNQ) derivative was added to the Oligo-SQs to impart positive photosensitivity. A Ph content ratio of over 50 mol% was found to be necessary for the Oligo-SQs to exhibit DNQ compatibility and good patterning performance. Infrared absorption spectroscopy analysis and density functional theory calculations indicated the formation of novel aromatic siloxane DNQ aggregates upon hydrogen bonding between hydroxyl group domains in the Oligo-SQ (formed by hydroxyl groups bonded to Si on adjacent Ph moieties) and the DNQ derivative, which adopts only one of its possible resonance structures.

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Low-Temperature-Curing Type Positive-Tone Photosensitive Polyimide Coatings for Insulating Layer in OLED Displays.

Cited by 13 publications

References 0 publications

Enhanced interaction in the polyimide/sepiolite hybrid films via acid activating and polydopamine coating of sepiolite

Enhanced interaction in the polyimide/sepiolite hybrid films via acid activating and polydopamine coating of sepiolite

Effect of UV Curing on Electrical Properties of a UV‐Curable co‐Polyacrylate/Silica Nanocomposite as a Transparent Encapsulation Resin for Device Packaging

Intermolecular interactions between sol–gel-derived random-structure oligomeric silsesquioxanes and a diazonaphthoquinone derivative

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