Low temperature adhesion bonding for BioMEMS

Abstract

A novel adhesive bonding technology has been developed based on the preparation of ultra-thin adhesive layers between precision machined cylinders and roll-to-surface print transfer onto micro-machined substrates. In contrast to many existing bonding technologies, this process is compatible with bio-functionalized devices since it operates at low temperatures and does not rely on cover plates previously pre-coated with adhesive. The process was initially developed for the bonding of glass/SU-8 structures to glass cover plates for the fabrication of micro-fluidic devices with integrated 3D-micro-electrode arrays. The precision of alignment is usually <2 µm. In addition, larger (6 inch) polymeric substrates with micro-machined channels have also been successfully bonded using this method.

Packaging of microfluidic chips via interstitial bonding technique

“…Recently, polymers have emerged as a popular substrate material owing to their unique properties such as biocompatibility, optical quality, high impact strength, low cost, good processibility for mass production, and being recyclable. Many bonding techniques for plastic microfluidic chips have been demonstrated including thermal bonding/lamination [12,13], applying adhesive or UV-curable resin [14][15][16], solvent bonding [17][18][19][20][21], plasma-aided bonding [22], microwave welding [23], ultrasonic welding [24], resin-gas injection technique [25], and laminated film bonding [26]. An overview of the bonding techniques can also be found in the literature [27,28].…”

Numerical modelling and measurement of cell trajectories in 3‐D under the influence of dielectrophoretic and hydrodynamic forces

“…The cover also consisting of COC was glued on top of the structure using a UV curable adhesive (Vitralit 1558) as described previously [84]. Fluidic ports were micro-milled into the cover.…”

Adhesive bonding of microfluidic chips: influence of process parameters

“…The applied technology is based on the previously presented transfer of an adhesive layer onto the microfluidic chip via rolls [11]. Any contact between the adhesive layer and bioreagents on the lid can thus be prevented.…”

“…Multiple approaches for bonding of microfluidic chips like laser welding [6], thermal bonding [7] or adhesive bonding [6,[8][9][10][11][12][13] currently exist. Depending on the boundary conditions for lab-on-a-chip development, e.g.…”

“…Further, no bioreagents can be immobilized on the lid. Thus, different approaches to only selectively cover the chip surface with adhesive have been reported, namely contact printing [6,9,10,13], the use of guide channels [8,12] or by a laminator [11]. The so far presented work allows for selecting a general approach for bonding.…”