To achieve an ultrashallow junction, a novel activation method for a B dopant in a Si wafer using a soft X-ray undulator in a synchrotron radiation facility was proposed. In addition, B10H14+ clusters were used to obtain high activation ratios and small junction depths. A low-sheet resistance of 245 Ω/sq was obtained using B10H14+ clusters and by soft X-ray irradiation at 490 °C. A p–n junction was fabricated at a treatment temperature of 440 °C without excessive dopant diffusion. The mechanism of low-temperature activation by soft X-ray irradiation is discussed in comparison with that of conventional furnace annealing and on the basis of the difference between B+ and B10H14+ clusters.