2012
DOI: 10.1109/ted.2011.2170216
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Low-Resistance Electrical Contact to Carbon Nanotubes With Graphitic Interfacial Layer

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Cited by 105 publications
(76 citation statements)
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“…In particular, CNTs showing optimal charge transport properties are promising candidates for replacing copper interconnects in nanoelectronics circuits provided that the Schottky barrier that forms at the interface between the CNT surface and the electrical contact can be engineered [6]. Reports on both semiconducting and metallic CNT devices show the influence of the CNT surface chemistry on the contact resistance [7,8]. Electrical contacts to CNTs have been fabricated with different metals and disparities in the resistance have been associated to the presence of oxygen at the CNT surface [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…In particular, CNTs showing optimal charge transport properties are promising candidates for replacing copper interconnects in nanoelectronics circuits provided that the Schottky barrier that forms at the interface between the CNT surface and the electrical contact can be engineered [6]. Reports on both semiconducting and metallic CNT devices show the influence of the CNT surface chemistry on the contact resistance [7,8]. Electrical contacts to CNTs have been fabricated with different metals and disparities in the resistance have been associated to the presence of oxygen at the CNT surface [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…How-ever, this resistance is hard to achieve because of the poor wetting properties of metal to CNTs and the presence of Schottky barriers (SBs) between the CNT and the metal due to band misalignment. Solutions include the use of graphitic carbon interfacial layers to increase the contact area between the metal and the CNT [29] and the selection of a proper work-function metal contact [30] to reduce the SB. …”
Section: Manufacturing Imperfections In Cnfets and Challengesmentioning
confidence: 99%
“…17 The Schottky barrier height depends on distinct metal. 18 Pd, Gold, copper, aluminum, and titanium metal were patterned using photolithography together with electron beam lithography. The contact was aligned through DEP force 19 for CNT, followed by medium temperature annealing.…”
Section: Carbon Nanotube Photodetectormentioning
confidence: 99%