Low‐profile transmitarray lens antenna of X‐band with one layer of substrate and metallic vias

Abstract

A low-profile transmitarray lens design is presented at X-band, which is composed of only one layer of substrate with thickness of 0.13 freespace wavelengths. The transmitted unit cell utilises structure of two metallic layers and four via holes, broadening the transmitted phase shift range to more than 310°while transmission magnitude is within −3 dB under normal incidence. A prototype of the transmitarray lens with aperture size of 280 mm is designed, simulated and measured. Measurement and simulation results agree well with each other and gain of 23.9 dBi is obtained at 10 GHz; the proposed lowprofile transmitarray lens antenna could be applied to practical X-band radar systems with low cost and convenience.

A low‐profile transmitarray antenna using square patch elements with cross dipole slots and vias

“…It can be observed that compared with multilayer structures like References and , the proposed antenna features significantly lower profile, better side‐lobe level, and higher aperture efficiency. Compared with low‐profile designs such as References and , the proposed transmitarray also demonstrates better or comparable performances.…”

“…In this paper, a novel transmitarray antenna comprising only a single‐layer substrate with double metallic layers connected by vias is presented. Instead of using Malta crosses or fractal squares with vias as the unit cell for low‐profile transmitarray designs, this work alternatively employs square patches etched with cross dipole slots with vias to realize a low‐profile design. The unit cell can provide the required transmission magnitude and phase with a thickness of 0.1 λ at 10 GHz.…”

“…It is observed that above‐mentioned designs feature a multilayer structure, which increases the fabrication complexity as well as the overall thickness and the cost. Recently, it is interestingly found that the transmitarray profile can be remarkably reduced by the employment of vias . With an arrangement of two identical metal layers connected by vias piercing through a single‐layer substrate, an additional coupling between the two metal layers is obtained to realize augmented transmission magnitude and enhanced transmission phase span.…”

“…Compared with those multilayer structures, the proposed transmitarray offers advantages of low‐profile, low‐cost, ease of manufacture, and light weight. Compared with those low‐profile designs in References and , this work demonstrates a superior behavior in terms of gain bandwidth and aperture efficiency.…”

“…Recently, it is interestingly found that the transmitarray profile can be remarkably reduced by the employment of vias. 13,14 With an arrangement of two identical metal layers connected by vias piercing through a single-layer substrate, an additional coupling between the two metal layers is obtained to realize augmented transmission magnitude and enhanced transmission phase span. Therefore, the insufficient phase range encountered in previous single-layer designs is subtly addressed.…”